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Tuesday, January 25, 2022

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Samsung-Esperanto Concept AI-SSD Prototype
EUV State, NXE:3600D, and Pellicle Readiness and Industrialization
Intel Launches 12th Gen Core Desktop Alder Lake Processors
TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

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Samsung-Esperanto Concept AI-SSD Prototype
November 21, 2021November 21, 2021 David Schor
EUV State, NXE:3600D, and Pellicle Readiness and Industrialization
November 20, 2021November 20, 2021 David Schor
Intel Launches 12th Gen Core Desktop Alder Lake Processors
October 27, 2021November 3, 2021 David Schor
TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
October 26, 2021October 26, 2021 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
October 20, 2021October 20, 2021 David Schor
Intel Introduces 2nd Gen Neuromorphic Research Chip: Loihi 2 on Intel 4 EUV Process
September 30, 2021September 30, 2021 David Schor

Random Picks

IBM Introduces Next-Gen Z Mainframe: The z15; Wider Cores, More Cores, More Cache, Still 5.2 GHz

September 14, 2019May 25, 2021 David Schor

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x86 WorldView All

Desktop Processors Mobile Processors

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Architectures Server Processors

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor

Architectures Data Processing Unit Desktop Processors Mobile Processors

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor

Architectures Desktop Processors Mobile Processors

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor

Architectures Desktop Processors Mobile Processors Server Processors

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor

Architectures Server Processors

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor

GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

September 21, 2019June 11, 2021 David Schor

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

April 5, 2020May 25, 2021 David Schor

Arm Launches the Cortex-M55 and Its MicroNPU Companion, the Ethos-U55

February 10, 2020May 25, 2021 David Schor

X-Gene 3 gets a second chance at Ampere with a new 32-core 16nm ARM processor

February 5, 2018May 25, 2021 David Schor

Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges

April 20, 2018May 25, 2021 David Schor

ARM WorldView All

Architectures Server Processors

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor

Data Processing Unit

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor

Architectures

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

IEDM 2020 Interconnects Packaging Subscriber Only Content

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor

Architectures Interconnects Network-on-Chip

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor

Architectures Interconnects Mobile Processors

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor

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