10 nm – WikiChip Fuse

Mobile Processors

Intel Launches Lakefield: An Experiment With Multiple New Technologies

June 15, 2020 David Schor 3 Comments 10 nm, 22 nm, 22FFL, 3D packaging, Core i3, Core i5, Foveros, Intel, Lakefield, Sunny Cove, Tremont

Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.

Architectures Hot Chips 31 IEDM 2019 ISSCC 2020

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

April 5, 2020 David Schor 1 Comment 10 nm, 22 nm, 22FFL, 3D packaging, Foveros, Intel, Lakefield, Sunny Cove, Tremont

A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.

IEDM 2019 Process Technologies Roadmaps

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019 David Schor 1 Comment 1.4 nm, 10 nm, 10nm, 2 nm, 3 nm, 5 nm, 7 nm, Intel

Intel’s process technology roadmap reveals decade-out plans, including a future 10nm+++ node and even a 1.4nm node heading into 2029.

Architectures Roadmaps Server Processors Supercomputers Supercomputing 19

SC19: Aurora Supercomputer To Feature Intel First Exascale Xe GPGPU, 7nm Ponte Vecchio

November 17, 2019 David Schor 1 Comment 10 nm, 7 nm, Aurora, Intel, Sapphire Rapids, Supercomputer, Supercomputers, x86, Xe

Intel unveils the node architecture of the Aurora Supercomputer; the system will feature Intel’s first Xe GPGPU for HPC, 7nm Ponte Vecchio.

Process Technologies VLSI 2018

VLSI 2018: Samsung’s 11nm nodelet, 11LPP

June 30, 2018 David Schor 0 Comments 10 nm, 11 nm, 11LPP, 14 nm, FinFET, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 11nm 11LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

June 17, 2018 David Schor 0 Comments 10 nm, 14 nm, 7 nm, 8 nm, FinFET, GlobalFoundries, Qualcomm, Samsung, VLSI 2018, VLSI Symposium

A preview of some of the process technology papers from next week’s VLSI Symposium.