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Thursday, September 21, 2023
Latest:
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
  • A Look At AMD’s 3D-Stacked V-Cache
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10 nm

Architectures Desktop Processors 

Intel Launches 12th Gen Core Desktop Alder Lake Processors

October 27, 2021November 3, 2021 David Schor 10 nm, 12 Generation Core, Alder Lake, Core i5, Core i7, Core i9, Intel, Intel 7

Intel launches 12th Gen Core desktop processors based on the Alder Lake microarchitecture.

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Foundries IEDM 2020 Process Technologies Subscriber Only Content 

Intel Talks 10nm DTCO, EUV Benefits

June 22, 2021August 2, 2021 David Schor 10 nm, 5 nm, 7 nm, EUV, IEDM, IEDM 2020, Intel, subscriber only (general)

Intel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.

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Packaging Power Management Subscriber Only Content 

The Magnets Under the Icy Lake

May 23, 2021July 8, 2021 David Schor 10 nm, Fully Integrated Voltage Regulator (FIVR), Ice Lake, subscriber only (general)

The magnets under the icy lake

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Foundries 

Q1 2021 Foundry Update: Spending Bonanza

May 18, 2021May 23, 2021 David Schor 10 nm, 3 nm, 5 nm, 7 nm, FinFET, GAA, Intel, Samsung, SMIC, TSMC

A look at the current state of leading-edge foundries for the first quarter of 2021.

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Embedded Processors Mobile Processors 

Intel Pushes Out Flagship Premium Tiger Lake Mobile Chips

May 13, 2021May 23, 2021 David Schor 10 nm, 11 Generation Core, Core i5, Core i7, Core i9, Intel, Tiger Lake, Willow Cove

In rolls out flagship premium performance 11th Generation Core Tiger Lake-based mobile processors with eight cores.

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Mobile Processors 

Intel Launches Lakefield: An Experiment With Multiple New Technologies

June 15, 2020May 23, 2021 David Schor 10 nm, 22 nm, 22FFL, 3D packaging, Core i3, Core i5, Foveros, Intel, Lakefield, Sunny Cove, Tremont

Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.

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Architectures Hot Chips 31 IEDM 2019 ISSCC 2020 

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

April 5, 2020May 25, 2021 David Schor 10 nm, 22 nm, 22FFL, 3D packaging, Foveros, Intel, Lakefield, Sunny Cove, Tremont

A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.

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IEDM 2019 Process Technologies Roadmaps 

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019May 25, 2021 David Schor 1.4 nm, 10 nm, 10nm, 2 nm, 3 nm, 5 nm, 7 nm, Intel

Intel’s process technology roadmap reveals decade-out plans, including a future 10nm+++ node and even a 1.4nm node heading into 2029.

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Architectures Roadmaps Server Processors Supercomputers Supercomputing 19 

SC19: Aurora Supercomputer To Feature Intel First Exascale Xe GPGPU, 7nm Ponte Vecchio

November 17, 2019May 25, 2021 David Schor 10 nm, 7 nm, Aurora, Intel, Sapphire Rapids, Supercomputer, Supercomputers, x86, Xe

Intel unveils the node architecture of the Aurora Supercomputer; the system will feature Intel’s first Xe GPGPU for HPC, 7nm Ponte Vecchio.

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Process Technologies VLSI 2018 

VLSI 2018: Samsung’s 11nm nodelet, 11LPP

June 30, 2018May 25, 2021 David Schor 10 nm, 11 nm, 11LPP, 14 nm, FinFET, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 11nm 11LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

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  • ← Previous

Top Six Articles

  • A Look At Intel 4 Process Technology
  • TSMC N3, And Challenges Ahead
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • A look at Nvidia’s NVLink interconnect and the NVSwitch
  • N3E Replaces N3; Comes In Many Flavors
  • Centaur New x86 Server Processor Packs an AI Punch

Recent

  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor

Random Picks

Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

May 25, 2021May 25, 2021 David Schor
Chuck Peddle: Personal Computer Pioneer, Dies At 82

Chuck Peddle: Personal Computer Pioneer, Dies At 82

December 24, 2019May 25, 2021 David Schor
Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes

Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes

December 22, 2018May 25, 2021 David Schor
Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019May 25, 2021 David Schor
TSMC N7+ EUV Process Starts Shipping

TSMC N7+ EUV Process Starts Shipping

October 7, 2019May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel Launches 3rd Gen Ice Lake Xeon Scalable

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor
Radeon RX 5700: Navi and the RDNA Architecture

Radeon RX 5700: Navi and the RDNA Architecture

February 23, 2020May 25, 2021 David Schor
Forschungszentrum Jülich is upgrading its computing power

Forschungszentrum Jülich is upgrading its computing power

January 23, 2018May 25, 2021 Matt Larson
Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons

Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons

July 15, 2019May 25, 2021 David Schor
Samsung Ramps 7nm, Preps 5nm, And Adds 6nm

Samsung Ramps 7nm, Preps 5nm, And Adds 6nm

April 16, 2019May 25, 2021 David Schor
TSMC Details 5 nm

TSMC Details 5 nm

March 21, 2020May 25, 2021 David Schor
Intel, SiFive Demo High-Performance  RISC-V Horse Creek Dev Platform On Intel 4 Process

Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

October 7, 2022October 7, 2022 David Schor

ARM WorldView All

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor

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