Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem David SchorARM TechCon 2018, Foundries, Packaging, Process TechnologiesOctober 28, 2018 Tagged 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows. Pages: 1 2 Read more
Hot Chips 30: Intel Kaby Lake G David SchorCircuit Design, Hot Chips 30, PackagingSeptember 9, 2018 Tagged 14nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86 A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30. Pages: 1 2 Read more
