Co-EMIB

Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality

May 17, 2020May 23, 2021 David Schor 2.5D packaging, 3D packaging, Co-EMIB, EMIB, Foveros, Intel

A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.

Interconnects Packaging

Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds Omni-Directional Interconnects

July 9, 2019May 25, 2021 David Schor 3D packaging, Co-EMIB, EMIB, Foveros, SemiCon, SemiConWest

Intel is expanding its packaging portfolio with more advanced 2.5D and 3D technologies including multiple 3D stacks and omnidirectional interconnects.