WikiChip Fuse
TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO

Update and analysis of TSMC 7-nanometer node low-power and high-performance cells, 2nd generation 7nm, and the design technology co-optimization (DTCO) effort that went into the Snapdragon 855 SoC.

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TSMC Starts 5-Nanometer Risk Production

TSMC 5-nanometer node has entered risk production with PDKs available for production design. Here’s is our initial density estimates.

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VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

A look at GlobalFoundries 12nm Leading Performance technology, 12LP, an enhanced 14nm process. The process was recently presented at the 2018 Symposia on VLSI Technology and Circuits.

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VLSI 2018: Samsung’s 8nm 8LPP, a 10nm extension

A look at Samsung’s 8nm 8LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

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VLSI 2018: Samsung’s 11nm nodelet, 11LPP

A look at Samsung’s 11nm 11LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

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VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

A preview of some of the process technology papers from next week’s VLSI Symposium.

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GlobalFoundries 14HP process, a marriage of two technologies

As IBM starts shipping their latest server microprocessors we take a look at the process technology that’s enabling those capabilities. Though largely thought to be the same as the original process IBM detailed back in 2014, following their fab selloff the process has undergone some unique changes making it a distinctly GlobalFoundries process now.

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IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects

At IEDM 2017 and ISSCC 2018 Intel detailed their upcoming 10nm node, an aggressively scaled 7nm-class process technology that features new scaling accelerators as well as cobalt interconnect for the first time in high-volume manufacturing.

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IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.

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IEDM 2017: Intel details 22FFL, a relaxed 14nm process for foundry customers, targets mobile and RF apps

At the 2017 IEDM Intel detailed their 22FFL process, a relaxed 14nm process for Intel’s custom foundry customers. 22FFL was optimized for mobile, IoT, and RF applications offering a cost competitive process with excellent performance and simple design rules.

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