A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.

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A Look At The ET-SoC-1, Esperanto’s Massively Multi-Core RISC-V Approach To AI

A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores.

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