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Latest:
  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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Samsung

Foundries Roadmaps Subscriber Only Content 

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor 4 nm, 5 nm, Extreme Ultraviolet (EUV) Lithography, Samsung, Samsung Foundry, subscriber only (general)

Samsung Foundry talks about EUV, wafer capacity and mid-term plans,pPellicles, and advanced node yield.

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Foundries Process Technologies Roadmaps 

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor 2 nm, 3 nm, 3GAAE, 3GAAP, 3GAE, 3GAP, 5LPE, GAAFET, nanosheet, Samsung, Samsung Foundry

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

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Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor 4 nm, 4LPE, 4LPP, FinFET, Samsung, Samsung Foundry, subscriber only (general)

A look at Samsung’s last leading-edge FinFET process node, 4nm 4LPE.

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Foundries Process Technologies Subscriber Only Content 

Samsung 17nm follows Intel 16

May 22, 2022May 22, 2022 David Schor 14 nm, 14LPP, 17 nm, 17LPV, 28 nm, 28LPP, Intel, Intel Foundry Services (IFS), Samsung, Samsung Foundry, subscriber only (general)

Samsung follows Intel 16 with a low-cost high-performance, 17-nanometer, 17LPV node.

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Architectures Neural Processors 

Samsung-Esperanto Concept AI-SSD Prototype

November 21, 2021November 21, 2021 David Schor AI-SSD, ASPLOS, ASPLOS 2021, Esperanto, Facebook, Samsung

Esperanto demonstrates a concept AI-SSD prototype in collaboration with Samsung aimed at accelerating data center workloads such as recommendation engines.

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Circuit Design Foundries ISSCC 2021 Process Technologies Roadmaps Subscriber Only Content VLSI 2021 

Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles

July 8, 2021July 8, 2021 David Schor 3 nm, GAA, Samsung, Samsung Foundry, subscriber only (general)

Samsung tapes out 3nm GAA test vehicle as it inches towards mass production

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Foundries IEDM 2020 Process Technologies Roadmaps Subscriber Only Content 

Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

May 21, 2021June 24, 2021 David Schor 3 nm, 4 nm, 4LPE, 4LPP, 5 nm, 5LPE, 5LPP, 7 nm, IEDM 2020, Samsung, Samsung Foundry, subscriber only (general)

Samsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.

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Foundries 

Q1 2021 Foundry Update: Spending Bonanza

May 18, 2021May 23, 2021 David Schor 10 nm, 3 nm, 5 nm, 7 nm, FinFET, GAA, Intel, Samsung, SMIC, TSMC

A look at the current state of leading-edge foundries for the first quarter of 2021.

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Architectures Mobile Processors 

Samsung M5 Core Details Show Up

November 21, 2019May 25, 2021 David Schor 7 nm, 7LPP, ARM, ARMv8, ARMv8.2, Exynos, Samsung

Samsung details the high-level changes to the Exynos M5 core found in the Exynos 990.

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ARM TechCon 2019 Process Technologies Roadmaps 

Samsung 5 nm and 4 nm Update

October 19, 2019May 25, 2021 David Schor 4LPE, 4nm, 5LPE, 5nm, Samsung

Update and analysis of Samsung’s upcoming 5-nanometer and 4-nanometer process technologies.

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  • ← Previous

Top Six Articles

  • A Look At The AMD Zen 2 Core
  • TSMC Details 5 nm
  • TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO
  • The Mesh Network For Next-Generation Neoverse Chips
  • IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery
  • IBM Doubles Its 14nm eDRAM Density, Adds Hundreds of Megabytes of Cache

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

Intel Launches 12th Gen Core Desktop Alder Lake Processors

Intel Launches 12th Gen Core Desktop Alder Lake Processors

October 27, 2021November 3, 2021 David Schor
ISSCC 2018: Intel’s Self-Powered Intelligent IoT Edge Mote

ISSCC 2018: Intel’s Self-Powered Intelligent IoT Edge Mote

April 2, 2018May 25, 2021 David Schor
Intel Stratix 10 DX Adds PCIe Gen 4.0, Cache Coherency: UPI As Stopgap

Intel Stratix 10 DX Adds PCIe Gen 4.0, Cache Coherency: UPI As Stopgap

September 20, 2019May 25, 2021 David Schor
Arm’s New Cortex-M55 Breathes Helium

Arm’s New Cortex-M55 Breathes Helium

June 20, 2020May 23, 2021 David Schor
The NPU Inside Every Intel PC

The NPU Inside Every Intel PC

September 30, 2022September 30, 2022 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel Updates Apollo Lake: More LPC Reliability Issues

Intel Updates Apollo Lake: More LPC Reliability Issues

September 9, 2019May 25, 2021 David Schor
Intel launches Gemini Lake

Intel launches Gemini Lake

December 11, 2017May 25, 2021 David Schor
Intel silently launches Knights Mill

Intel silently launches Knights Mill

December 18, 2017May 25, 2021 David Schor
Ice Lake Brings A New CPU, GPU, IPU, and I/Os, To Follow By Tiger Lake Next Year

Ice Lake Brings A New CPU, GPU, IPU, and I/Os, To Follow By Tiger Lake Next Year

May 12, 2019May 25, 2021 David Schor
ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging

ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging

March 24, 2018May 25, 2021 David Schor
VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

July 22, 2018May 25, 2021 David Schor
Intel Launches Mainstream Cascade Lake Xeon W Workstation Processors

Intel Launches Mainstream Cascade Lake Xeon W Workstation Processors

October 7, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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