Samsung

Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

May 21, 2021May 23, 2021 David Schor 3 nm, 4 nm, 4LPE, 4LPP, 5 nm, 5LPE, 5LPP, 7 nm, IEDM 2020, Samsung, Samsung Foundry, subscriber only (general)

Samsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.

Foundries

Q1 2021 Foundry Update: Spending Bonanza

May 18, 2021May 23, 2021 David Schor 10 nm, 3 nm, 5 nm, 7 nm, FinFET, GAA, Intel, Samsung, SMIC, TSMC

A look at the current state of leading-edge foundries for the first quarter of 2021.

Architectures Mobile Processors

Samsung M5 Core Details Show Up

November 21, 2019May 25, 2021 David Schor 7 nm, 7LPP, ARM, ARMv8, ARMv8.2, Exynos, Samsung

Samsung details the high-level changes to the Exynos M5 core found in the Exynos 990.

ARM TechCon 2019 Process Technologies Roadmaps

Samsung 5 nm and 4 nm Update

October 19, 2019May 25, 2021 David Schor 4LPE, 4nm, 5LPE, 5nm, Samsung

Update and analysis of Samsung’s upcoming 5-nanometer and 4-nanometer process technologies.

Architectures Mobile Processors

Samsung Discloses Exynos M4 Changes, Upgrades Support for ARMv8.2, Rearranges The Back-End

January 14, 2019May 25, 2021 David Schor 8LPP, ARM, ARMv8, ARMv8.2, Exynos, Samsung

Samsung details the initial changes to the Exynos M4 core found in the Exynos 9820 which will be in Samsung’s next-generation Galaxy S10 smartphone.

Foundries Process Technologies Roadmaps Server Processors

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

December 20, 2018May 25, 2021 David Schor 7LPP, 7nm, Common Platform Alliance, EUV, IBM, POWER, Power ISA, POWER10, Samsung, Z

IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.

ARM TechCon 2018 Foundries Packaging Process Technologies

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

October 28, 2018May 25, 2021 David Schor 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

Process Technologies VLSI 2018

VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

August 4, 2018May 25, 2021 David Schor 7LPP, 7nm, EUV, process technology, Samsung, VLSI 2018, VLSI Symposium

A look at Samsungâ€™s 2nd generation 7nm process that was recently disclosed at the 38th Symposium on VLSI Technology.

Process Technologies VLSI 2018

VLSI 2018: Samsung’s 8nm 8LPP, a 10nm extension

July 1, 2018May 25, 2021 David Schor 10LPE, 10LPP, 10nm, 8LPP, 8nm, FinFET, Samsung, VLSI 2018, VLSI Symposium

A look at Samsungâ€™s 8nm 8LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

Process Technologies VLSI 2018

VLSI 2018: Samsung’s 11nm nodelet, 11LPP

June 30, 2018May 25, 2021 David Schor 10 nm, 11 nm, 11LPP, 14 nm, FinFET, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 11nm 11LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

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