GlobalFoundries

7nm Boosted Zen 2 Capabilities but Doubled the Challenges

Architectures Floorplanning Interconnects ISSCC 2020 February 21, 2020 2

The transition to 7 nm greatly enhanced AMD silicon capabilities but introduced new drastic design challenges that required new place and route methodologies and wire engineering.

Ayar Labs Realizes Co-Packaged Silicon Photonics

Architectures Circuit Design Hot Chips 31 Interconnects Packaging January 19, 2020 0

Integrated photonics has long been considered a holy grail for communication. Ayar Labs TeraPHY chiplet represents a major step forward through the co-packaging of the optical interface along with an SoC.

GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

Architectures Interconnects Packaging Process Technologies September 21, 2019 2

GlobalFoundries and Arm demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications.

DARPA ERI: How Ayar Labs Collaboration With GF Produces A Photonics Chiplet That Can Supercharge Intel FPGAs

Architectures Circuit Design ERI Summit 2019 FPGAs July 20, 2019 0

From a DARPA vision and a $15 million seed to a commercialized CMOS silicon photonics product: how Ayar Labs collaboration with GF produces a photonics chiplet that can supercharge Intel FPGAs.

VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

Foundries Process Technologies VLSI 2018 July 22, 2018 0

A look at GlobalFoundries 12nm Leading Performance technology, 12LP, an enhanced 14nm process. The process was recently presented at the 2018 Symposia on VLSI Technology and Circuits.

VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

VLSI 2018 June 17, 2018 0

A preview of some of the process technology papers from next week’s VLSI Symposium.

GlobalFoundries 14HP process, a marriage of two technologies

Process Technologies March 2, 2018 2

As IBM starts shipping their latest server microprocessors we take a look at the process technology that’s enabling those capabilities. Though largely thought to be the same as the original process IBM detailed back in 2014, following their fab selloff the process has undergone some unique changes making it a distinctly GlobalFoundries process now.

AMD Tech Day: the momentum continues with new products, new prices, and 12nm and 7nm announcements

CES 2018 Processors January 8, 2018 0

As they continue on building momentum, AMD held an impressive Tech Day at CES 2018 unveiling a series of products and detailing their aggressive roadmap going forward.

IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

IEDM 2017 Process Technologies December 21, 2017 3

At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.