GlobalFoundries

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor 12 nm, 12LP, 3D packaging, ARM, CMN-600, die stacking, Direct Bond Interconnect (DBI), GlobalFoundries, hybrid bonding, IEDM, IEDM 2020, subscriber only (general), Trishul (Arm test chip)

With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.

Architectures Floorplanning Interconnects ISSCC 2020

7nm Boosted Zen 2 Capabilities but Doubled the Challenges

February 21, 2020May 25, 2021 David Schor 14 nm, 7 nm, AMD, capacitance, GlobalFoundries, ISSCC, ISSCC 2020, resistance, TSMC, wire delay, Zen, Zen 2

The transition to 7 nm greatly enhanced AMD silicon capabilities but introduced new drastic design challenges that required new place and route methodologies and wire engineering.

Architectures Circuit Design Hot Chips 31 Interconnects Packaging

Ayar Labs Realizes Co-Packaged Silicon Photonics

January 19, 2020May 25, 2021 David Schor 45 nm, 45RFSOI, Ayar Labs, chiplet, GlobalFoundries, GlobalFoundries Technology Conference (GTC), Hot Chips, Hot Chips 31, Intel, multi-chip package, Photonics, silicon photonics, Stratix 10, TeraPHY

Integrated photonics has long been considered a holy grail for communication. Ayar Labs TeraPHY chiplet represents a major step forward through the co-packaging of the optical interface along with an SoC.

Architectures Interconnects Packaging Process Technologies

GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

September 21, 2019June 11, 2021 David Schor 12LP, 12nm, 3D packaging, ARM, CMN-600, design-for-test, Direct Bond Interconnect (DBI), GlobalFoundries, hybrid bonding, Trishul (Arm test chip)

GlobalFoundries and Arm demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications.

Architectures Circuit Design ERI Summit 2019 FPGAs

DARPA ERI: How Ayar Labs Collaboration With GF Produces A Photonics Chiplet That Can Supercharge Intel FPGAs

July 20, 2019May 25, 2021 David Schor 45 nm, 45RFSOI, Advanced Interface Bus (AIB), Ayar Labs, chiplet, DARPA, EMIB, ERI Summit, ERI Summit 2019, FPGA, GlobalFoundries, Photonics, RISC-V, Stratix 10

From a DARPA vision and a $15 million seed to a commercialized CMOS silicon photonics product: how Ayar Labs collaboration with GF produces a photonics chiplet that can supercharge Intel FPGAs.

Foundries Process Technologies VLSI 2018

VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

July 22, 2018May 25, 2021 David Schor 12 nm, 12LP, 14 nm, 14LPP, FinFET, GlobalFoundries, process technology

A look at GlobalFoundries 12nm Leading Performance technology, 12LP, an enhanced 14nm process. The process was recently presented at the 2018 Symposia on VLSI Technology and Circuits.

VLSI 2018

VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

June 17, 2018May 25, 2021 David Schor 10 nm, 14 nm, 7 nm, 8 nm, FinFET, GlobalFoundries, Qualcomm, Samsung, VLSI 2018, VLSI Symposium

A preview of some of the process technology papers from next week’s VLSI Symposium.

Process Technologies

GlobalFoundries 14HP process, a marriage of two technologies

March 2, 2018May 25, 2021 David Schor 14 nm, 14HP, FinFET, GlobalFoundries, IBM, process technology, silicon on insulator, SOI

As IBM starts shipping their latest server microprocessors we take a look at the process technology that’s enabling those capabilities. Though largely thought to be the same as the original process IBM detailed back in 2014, following their fab selloff the process has undergone some unique changes making it a distinctly GlobalFoundries process now.

CES 2018 Processors

AMD Tech Day: the momentum continues with new products, new prices, and 12nm and 7nm announcements

January 8, 2018May 25, 2021 David Schor 12nm, 7nm, AM4, AMD, GlobalFoundries, Navi, Radeon, Radeon Vega, Ryzen, Ryzen Mobile, Ryzen Pro, Vega, x86, Zen, Zen 2, Zen 3

As they continue on building momentum, AMD held an impressive Tech Day at CES 2018 unveiling a series of products and detailing their aggressive roadmap going forward.

IEDM 2017 Process Technologies

IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

December 21, 2017May 25, 2021 David Schor 7LP, 7nm, AMD, EUV, FinFET, GlobalFoundries, IBM, IEDM, IEDM 2017, process technology, SADP, SAQP

At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.