Your Chips and Semi News
With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.
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The transition to 7 nm greatly enhanced AMD silicon capabilities but introduced new drastic design challenges that required new place and route methodologies and wire engineering.
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Integrated photonics has long been considered a holy grail for communication. Ayar Labs TeraPHY chiplet represents a major step forward through the co-packaging of the optical interface along with an SoC.
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GlobalFoundries and Arm demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications.
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From a DARPA vision and a $15 million seed to a commercialized CMOS silicon photonics product: how Ayar Labs collaboration with GF produces a photonics chiplet that can supercharge Intel FPGAs.
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A look at GlobalFoundries 12nm Leading Performance technology, 12LP, an enhanced 14nm process. The process was recently presented at the 2018 Symposia on VLSI Technology and Circuits.
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A preview of some of the process technology papers from next week’s VLSI Symposium.
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As IBM starts shipping their latest server microprocessors we take a look at the process technology that’s enabling those capabilities. Though largely thought to be the same as the original process IBM detailed back in 2014, following their fab selloff the process has undergone some unique changes making it a distinctly GlobalFoundries process now.
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As they continue on building momentum, AMD held an impressive Tech Day at CES 2018 unveiling a series of products and detailing their aggressive roadmap going forward.
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At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.
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