12LP | WikiChip Fuse

GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

Architectures Interconnects Packaging Process Technologies September 21, 2019 2

GlobalFoundries and Arm demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications.

AMD Announces Threadripper 2, Chiplets Aid Core Scaling

Desktop Processors August 7, 2018 0

AMD announces their second-generation Threadripper processors with up to 32 cores based on their 12nm Zen+ microarchitecture.

VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

Foundries Process Technologies VLSI 2018 July 22, 2018 0

A look at GlobalFoundries 12nm Leading Performance technology, 12LP, an enhanced 14nm process. The process was recently presented at the 2018 Symposia on VLSI Technology and Circuits.