WikiChip Fuse
GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

GlobalFoundries and Arm demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications.

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AMD Announces Threadripper 2, Chiplets Aid Core Scaling

AMD announces their second-generation Threadripper processors with up to 32 cores based on their 12nm Zen+ microarchitecture.

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VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

A look at GlobalFoundries 12nm Leading Performance technology, 12LP, an enhanced 14nm process. The process was recently presented at the 2018 Symposia on VLSI Technology and Circuits.

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