Mobile Processors

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor ARM, ARMv9, DSU-110, Memory Tagging Extension (MTE)

Arm introduces its new DynamIQ Share Unit 110 for new Armv9 CPUs

Architectures Embedded Processors Mobile Processors

Arm Launches Its New Flagship Performance Armv9 Core: Cortex-X2

May 25, 2021May 25, 2021 David Schor ARM, ARMv9, Cortex-X, Cortex-X2, Scalable Vector Extension 2 (SVE2)

Arm launches the Cortex-X2, second-generation Cortex-X, and their new flagship performance Armv9 big core.

Architectures Embedded Processors Mobile Processors

Arm Unveils Next-Gen Armv9 Little Core: Cortex-A510

May 25, 2021May 26, 2021 David Schor ARM, ARMv9, Cortex-A, Cortex-A510, Scalable Vector Extension 2 (SVE2)

Arm introduces their new Armv9 little core, the Cortex-A510 with significant PPA improvements.

Architectures Embedded Processors Mobile Processors

Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

May 25, 2021May 25, 2021 David Schor ARM, ARMv9, Cortex-A, Cortex-A710, Scalable Vector Extension 2 (SVE2)

Arm unveils their newest Armv9 big core, the Cortex-A710.

Architectures Graphics Processors Hot Chips 33 Mobile Processors Neural Processors Server Processors Vector Processors

Hot Chips 33 Program: Alder Lake, Sapphire Rapids, Zen 3, Next-Gen Z, Neoverse N2, And Many More

May 13, 2021May 23, 2021 David Schor AMD, ARM, Cerebras, Esperanto, Hot Chips, Hot Chips 33, Intel, Nvidia

The IEEE Symposium on High-Performance Chips Program Committee announced the program for the 2021 Hot Chips 33 conference.

Embedded Processors Mobile Processors

Intel Pushes Out Flagship Premium Tiger Lake Mobile Chips

May 13, 2021May 23, 2021 David Schor 10 nm, 11 Generation Core, Core i5, Core i7, Core i9, Intel, Tiger Lake, Willow Cove

In rolls out flagship premium performance 11th Generation Core Tiger Lake-based mobile processors with eight cores.

Mobile Processors

Intel Launches Lakefield: An Experiment With Multiple New Technologies

June 15, 2020May 23, 2021 David Schor 10 nm, 22 nm, 22FFL, 3D packaging, Core i3, Core i5, Foveros, Intel, Lakefield, Sunny Cove, Tremont

Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.

Architectures Mobile Processors

Arm Unveils the Cortex-A78: When Less Is More

May 26, 2020May 23, 2021 David Schor 5 nm, ARM, ARMv8.2, Cortex, Cortex-A77, Cortex-A78

Arm unveils the Cortex-A78 microarchitecture for next-generation flagship smartphones.

Architectures Mobile Processors

Arm Cortex-X1: The First From The Cortex-X Custom Program

May 26, 2020May 23, 2021 David Schor 5 nm, ARM, ARMv8.2, Cortex, Cortex-A78, Cortex-X, Cortex-X1

Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program.

Desktop Processors Mobile Processors

Intel Launches 10th Gen Comet Lake vPro Processors

May 13, 2020May 23, 2021 David Schor Comet Lake, Core i5, Core i7, Core i9, Intel, vPro

Intel launches its 10th-generation Comet Lake-based vPro processors.

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