David Schor – WikiChip Fuse

Packaging Subscriber Only Content

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor 2.5D packaging, 3D packaging, HPC, hybrid bonding, SoIC, SoIC_H, SRAM cube, subscriber only (general), TSMC

[Subscription] TSMC demonstrates SoIC_H for next-generation high-bandwidth HPC applications.

Architectures Desktop Processors Mobile Processors

Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

October 1, 2022October 3, 2022 David Schor 13 Generation Core, 7 nm, Alder Lake, Intel, Intel 7, Intel Core, Intel Innovation 2022, Raptor Cove, Raptor Lake

Intel rolls out 13th Generation Core, “Raptor Lake” client processors; cranks up the frequency.

Architectures Neural Processors Subscriber Only Content

The NPU Inside Every Intel PC

September 30, 2022September 30, 2022 David Schor Intel, subscriber only (general)

[Subscription] A look at the neural processor inside every Intel processor.

AI Hardware Summit Architectures Embedded Processors Interconnects Linley Processor Conference Neural Processors

SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

September 20, 2022September 20, 2022 David Schor AI, AI Hardware Summit, Linley Processor Conference, neural processors, SiFive, Vector Coprocessor Interface Extension (VCIX)

SiFive introduces a new high-performance coprocessor interface targeting custom accelerators; scores design wins from Google, NASA.

Process Technologies

N3E Replaces N3; Comes In Many Flavors

September 4, 2022September 4, 2022 David Schor 3 nm, FinFlex, N3, N3E, TSMC

TSMC outlines a number of 3-nanometer class node changes and flavors.

Foundries Roadmaps Subscriber Only Content

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor 4 nm, 5 nm, Extreme Ultraviolet (EUV) Lithography, Samsung, Samsung Foundry, subscriber only (general)

Samsung Foundry talks about EUV, wafer capacity and mid-term plans,pPellicles, and advanced node yield.

Foundries Process Technologies Roadmaps

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor 2 nm, 3 nm, 3GAAE, 3GAAP, 3GAE, 3GAP, 5LPE, GAAFET, nanosheet, Samsung, Samsung Foundry

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

Architectures Mobile Processors

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor ARM, ARMv9, Cortex, Cortex-A, Cortex-A510

Arm refreshes the Cortex-A510 core, squeezes higher efficiency.

Mobile Processors

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor ARM, Cortex, Cortex-A, Cortex-X, Cortex-X2, Cortex-X3

Arm announces its next-generation flagship core: the Cortex-X3.

Architectures Mobile Processors

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor ARM, ARMv9, Cortex, Cortex-A, Cortex-A710, Cortex-A715, Makalu

Arm introduces next-generation big core: Cortex-A715.

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