Process Technologies

EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

November 20, 2021November 20, 2021 David Schor ASML, Extreme Ultraviolet (EUV) Lithography, High-NA, subscriber only (general)

A look at the current state of EUV machines, the new NXE:3600D, and EUV pellicle readiness and industrialization.

Foundries Process Technologies Roadmaps

TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

October 26, 2021October 26, 2021 David Schor 5 nm, Extreme Ultraviolet (EUV) Lithography, FinFET, N4, N4P, N5, TSMC

TSMC introduces a new 5-nanometer derivative – an enhanced performance N4P node.

Foundries Process Technologies Roadmaps

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor Extreme Ultraviolet (EUV) Lithography, Intel, Intel 20A, Intel 3, Intel 4, Intel 7

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

Foundries Process Technologies Roadmaps

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor 20 Å, GAA, Intel, Intel 20A, PowerVia, RibbonFET

Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.

Circuit Design Foundries ISSCC 2021 Process Technologies Roadmaps Subscriber Only Content VLSI 2021

Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles

July 8, 2021July 8, 2021 David Schor 3 nm, GAA, Samsung, Samsung Foundry, subscriber only (general)

Samsung tapes out 3nm GAA test vehicle as it inches towards mass production

Foundries Process Technologies Roadmaps Subscriber Only Content

TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap

July 6, 2021July 6, 2021 David Schor 5 nm, 7 nm, HPC, N5A, N5HPC, N6RF, N7HPC, subscriber only (general)

A TSMC 2021 foundry update: automotive, networking, and HPC roadmap.

Foundries Process Technologies Roadmaps Subscriber Only Content

TSMC 2021 Foundry Update: Foundry Roadmap

July 6, 2021July 6, 2021 David Schor 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, Extreme Ultraviolet (EUV) Lithography, FinFET, N2 2 nm, N3, N4, N5, N6, N7, subscriber only (general), TSMC

TSMC 2021 foundry update

Foundries IEDM 2020 Process Technologies Subscriber Only Content

Intel Talks 10nm DTCO, EUV Benefits

June 22, 2021August 2, 2021 David Schor 10 nm, 5 nm, 7 nm, EUV, IEDM, IEDM 2020, Intel, subscriber only (general)

Intel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.

Foundries IEDM 2020 Process Technologies Roadmaps Subscriber Only Content

Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

May 21, 2021June 24, 2021 David Schor 3 nm, 4 nm, 4LPE, 4LPP, 5 nm, 5LPE, 5LPP, 7 nm, IEDM 2020, Samsung, Samsung Foundry, subscriber only (general)

Samsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.

Interconnects Packaging Process Technologies

Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality

May 17, 2020May 23, 2021 David Schor 2.5D packaging, 3D packaging, Co-EMIB, EMIB, Foveros, Intel

A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.

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