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Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality

A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.

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TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon.

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TSMC Details 5 nm

TSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.

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TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications

TSMC announces an enhancement to its CoWoS packaging technology with support for up to 2x the reticle size. The new technology is ready for next-generation 5-nanometer HPC applications.

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TSMC Digs Trenches In Search Of Higher Performance

TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.

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UMC Rolls Out 22-Nanometer

UMC says it has started rolling out its 22-nanometer planar process, offering a new lower-power and cost-sensitive migration path from existing 40nm and 28nm nodes.

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Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

Intel’s process technology roadmap reveals decade-out plans, including a future 10nm+++ node and even a 1.4nm node heading into 2029.

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TSMC 5-Nanometer Update

An update on TSMC’s upcoming 5-nanometer process technology.

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Samsung 5 nm and 4 nm Update

Update and analysis of Samsung’s upcoming 5-nanometer and 4-nanometer process technologies.

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Intel Expands 22FFL With Production-Ready RRAM and MRAM on FinFET

Intel expands its 22FFL process with new production-ready MRAM and RRAM technologies.

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