Process Technologies

GlobalFoundries 14HP process, a marriage of two technologies

David SchorProcess TechnologiesMarch 2, 2018 Tagged 14HP, 14nm, FinFET, GlobalFoundries, IBM, process technology, silicon on insulator, SOI

As IBM starts shipping their latest server microprocessors we take a look at the process technology that’s enabling those capabilities. Though largely thought to be the same as the original process IBM detailed back in 2014, following their fab selloff the process has undergone some unique changes making it a distinctly GlobalFoundries process now.

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IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects

David SchorIEDM 2017, ISSCC 2018, Process TechnologiesFebruary 17, 2018 Tagged 10nm, FinFET, IEDM, IEDM 2017, Intel, ISSCC, ISSCC 2018, process technology

At IEDM 2017 and ISSCC 2018 Intel detailed their upcoming 10nm node, an aggressively scaled 7nm-class process technology that features new scaling accelerators as well as cobalt interconnect for the first time in high-volume manufacturing.

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IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

David SchorIEDM 2017, Process TechnologiesDecember 21, 2017 Tagged 7LP, 7nm, AMD, EUV, FinFET, GlobalFoundries, IBM, IEDM, IEDM 2017, process technology, SADP, SAQP

At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.

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IEDM 2017: Intel details 22FFL, a relaxed 14nm process for foundry customers, targets mobile and RF apps

David SchorIEDM 2017, Process TechnologiesDecember 15, 2017 Tagged 14nm, 22FFL, 22nm, ASIC, FinFET, IEDM, IEDM 2017, Intel, Intel Custom Foundry, Interconnect, process technology, Radio Frequency

At the 2017 IEDM Intel detailed their 22FFL process, a relaxed 14nm process for Intel’s custom foundry customers. 22FFL was optimized for mobile, IoT, and RF applications offering a cost competitive process with excellent performance and simple design rules.

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Samsung 2nd gen 10nm enters HVM, S3 fab ready for primetime

David SchorProcess TechnologiesNovember 29, 2017 Tagged 10LPP, 10nm, 7LPP, 7nm, 8LPP, 8nm, EUV, Samsung

Samsung has announced that its 2nd generation 10nm process has entered mass production. The company also announced that their S3-Line fab in South Korea is ready to ramp up production.