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  • A Look At AMD’s 3D-Stacked V-Cache
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications
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Process Technologies

Process Technologies 

N3E Replaces N3; Comes In Many Flavors

September 4, 2022September 4, 2022 David Schor 3 nm, FinFlex, N3, N3E, TSMC

TSMC outlines a number of 3-nanometer class node changes and flavors.

Read more
Foundries Process Technologies Roadmaps 

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor 2 nm, 3 nm, 3GAAE, 3GAAP, 3GAE, 3GAP, 5LPE, GAAFET, nanosheet, Samsung, Samsung Foundry

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

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Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor 4 nm, 4LPE, 4LPP, FinFET, Samsung, Samsung Foundry, subscriber only (general)

A look at Samsung’s last leading-edge FinFET process node, 4nm 4LPE.

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Foundries Process Technologies VLSI 2022 

A Look At Intel 4 Process Technology

June 19, 2022June 20, 2022 David Schor 4 nm, 5 nm, 7 nm, Extreme Ultraviolet (EUV) Lithography, Intel, Intel 3, Intel 4, Intel 7, Intel Foundry Services (IFS), Meteor Lake, VLSI 2022, VLSI Symposium

A look at Intel’s next-generation high-performance process technology, Intel 4.

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Foundries Process Technologies Subscriber Only Content 

Samsung 17nm follows Intel 16

May 22, 2022May 22, 2022 David Schor 14 nm, 14LPP, 17 nm, 17LPV, 28 nm, 28LPP, Intel, Intel Foundry Services (IFS), Samsung, Samsung Foundry, subscriber only (general)

Samsung follows Intel 16 with a low-cost high-performance, 17-nanometer, 17LPV node.

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Foundries Process Technologies Roadmaps Subscriber Only Content 

EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

November 20, 2021November 20, 2021 David Schor ASML, Extreme Ultraviolet (EUV) Lithography, High-NA, subscriber only (general)

A look at the current state of EUV machines, the new NXE:3600D, and EUV pellicle readiness and industrialization.

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Foundries Process Technologies Roadmaps 

TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

October 26, 2021October 26, 2021 David Schor 5 nm, Extreme Ultraviolet (EUV) Lithography, FinFET, N4, N4P, N5, TSMC

TSMC introduces a new 5-nanometer derivative – an enhanced performance N4P node.

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Foundries Process Technologies Roadmaps 

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor Extreme Ultraviolet (EUV) Lithography, Intel, Intel 20A, Intel 3, Intel 4, Intel 7

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

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Foundries Process Technologies Roadmaps 

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor 20 Å, GAA, Intel, Intel 20A, PowerVia, RibbonFET

Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.

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Circuit Design Foundries ISSCC 2021 Process Technologies Roadmaps Subscriber Only Content VLSI 2021 

Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles

July 8, 2021July 8, 2021 David Schor 3 nm, GAA, Samsung, Samsung Foundry, subscriber only (general)

Samsung tapes out 3nm GAA test vehicle as it inches towards mass production

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  • ← Previous

Top Six Articles

  • A Look At Intel 4 Process Technology
  • IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • N3E Replaces N3; Comes In Many Flavors
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips

Recent

  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    November 1, 2022November 2, 2022 David Schor
  • Intel, SiFive Demo High-Performance  RISC-V Horse Creek Dev Platform On Intel 4 Process

    Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

    October 7, 2022October 7, 2022 David Schor
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    October 4, 2022October 4, 2022 David Schor
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    October 1, 2022October 3, 2022 David Schor

Random Picks

Intel, SiFive Demo High-Performance  RISC-V Horse Creek Dev Platform On Intel 4 Process

Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

October 7, 2022October 7, 2022 David Schor
VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

July 22, 2018May 25, 2021 David Schor
Inside PFN’s AI Processor And The World’s Most Power-Efficient Supercomputer

Inside PFN’s AI Processor And The World’s Most Power-Efficient Supercomputer

September 20, 2021September 20, 2021 David Schor
Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

February 20, 2022February 21, 2022 David Schor
Forschungszentrum Jülich is upgrading its computing power

Forschungszentrum Jülich is upgrading its computing power

January 23, 2018May 25, 2021 Matt Larson

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel Silently Launches Cannon Lake

Intel Silently Launches Cannon Lake

May 15, 2018May 25, 2021 David Schor
AMD launches EPYC Embedded 3000 and Ryzen Embedded V1000 SoCs

AMD launches EPYC Embedded 3000 and Ryzen Embedded V1000 SoCs

February 23, 2018May 25, 2021 David Schor
ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

June 16, 2018May 25, 2021 David Schor
Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures

Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures

July 24, 2018May 25, 2021 David Schor
Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

May 21, 2021June 24, 2021 David Schor
IBM Releases Power ISA v3.1; To Present POWER10 At Hot Chips 32

IBM Releases Power ISA v3.1; To Present POWER10 At Hot Chips 32

May 23, 2020May 23, 2021 David Schor
Fujitsu launches a deep learning accelerator for industrial apps

Fujitsu launches a deep learning accelerator for industrial apps

January 16, 2018May 25, 2021 Matt Larson

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

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