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Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021

An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.

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Samsung Ramps 7nm, Preps 5nm, And Adds 6nm

Samsung is announcing the completion of their 5-nanometer process design and the ramping of their 7 nm process.

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TSMC Announces 6-Nanometer Process

TSMC announces the 6-nanometer process, an enhanced 7 nm EUV node.

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TSMC Starts 5-Nanometer Risk Production

TSMC 5-nanometer node has entered risk production with PDKs available for production design. Here’s is our initial density estimates.

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IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery

Presented at the 64th IEEE International Electron Devices Meeting (IEDM) in December, here’s a look at Intel’s 10-nanometer standard cell library and power delivery system.

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Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes

At the recent Intel Architecture Day, the company unveiled their latest advanced packaging technology called Foveros, a face-to-face three-dimensional (3D) die stacking packaging technology in an effort to assist with the slowing of Moore’s Law.

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IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.

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Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

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Nantero’s NRAM, A Universal Memory Candidate?

Presented at Hot Chips 30, a look at Nantero’s NRAM, a high-performance carbon nanotube-based memory billed as a DRAM successor.

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VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

A look at Samsung’s 2nd generation 7nm process that was recently disclosed at the 38th Symposium on VLSI Technology.

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