Intel Talks 10nm DTCO, EUV Benefits
The 66th IEEE International Electron Devices Meeting (IEDM) was held virtually from late 2020 through early 2021. One of the invited talks at the advanced technologies session was from Intel which was presented by Sr. Principal Engineering Manager Andy Wei. At the presentation, Intel provided some more insight into the motivations for some of the features that were incorporated into their 10-nanometer process. The company also discussed some benefits of EUV and provided some tidbits on their future process nodes.
When Intel first designed its 10-nanometer node,
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