WikiChip Fuse
Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality

A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.

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Intel Launches 10th Gen Comet Lake vPro Processors

Intel launches its 10th-generation Comet Lake-based vPro processors.

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Intel Launches Entry-Level Comet Lake Xeon Ws

Intel launches a new series of Xeon W processors for entry-level workstations based on Comet Lake.

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Intel Launches 10th Gen Comet Lake Desktop Processors

Intel launches 10th Generation Core desktop processors, formerly codename Comet Lake. The new lineup brings 22 new chips with up to 10 cores and 20 threads with turbo frequencies of up to 5.3 GHz.

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A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.

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Intel Refreshes 2nd Gen Xeon Scalable, Slashes Prices

Intel refreshes its second-generation Xeon Scalable lineup mid-cycle with new mainstream dual-socket CPUs, improving the performance-per-dollar by as much as 2x over original SKUs.

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Intel Axes Nervana Just Two Months After Launch

Intel axes Nervana in favor of Habana.

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Ayar Labs Realizes Co-Packaged Silicon Photonics

Integrated photonics has long been considered a holy grail for communication. Ayar Labs TeraPHY chiplet represents a major step forward through the co-packaging of the optical interface along with an SoC.

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Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

Intel’s process technology roadmap reveals decade-out plans, including a future 10nm+++ node and even a 1.4nm node heading into 2029.

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Intel Starts Shipping Initial Nervana NNP Lineup

Intel starts shipping its initial Nervana NNP lineup for both inference and training acceleration with four initial models in three different form factors.

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