Intel

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor Intel, scheduler, x86

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor Advanced Matrix Extension (AMX), AVX-512, Golden Cove, Intel, Intel 7, Sapphire Rapids, x86

Intel unveiled Sapphire Rapids, its next-generation server CPUs

Architectures Data Processing Unit Desktop Processors Mobile Processors

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor Alder Lake, Gracemont, Intel, Intel 7, Tremont, x86

Intel’s Gracemont small core eclipses last-generation Skylake big core performance and energy efficiency

Architectures Desktop Processors Mobile Processors

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor Alder Lake, DDR5, Golden Cove, Gracemont, Intel, Intel 7, LPDDR5x, PCIe 5.0, x86

Intel unveiled Alder Lake, the company’s next-generation mainstream heterogeneous multi-core SoC for mobile through desktop

Architectures Desktop Processors Mobile Processors Server Processors

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor Alder Lake, Golden Cove, Intel, Intel 7, Sapphire Rapids, x86

Intel details Golden Cove, the company’s next-generation big core for client and server SoCs

Packaging Roadmaps

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor 3D packaging, die stacking, EMIB, Foveros, Intel

Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding

Foundries Process Technologies Roadmaps

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor Extreme Ultraviolet (EUV) Lithography, Intel, Intel 20A, Intel 3, Intel 4, Intel 7

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

Foundries Process Technologies Roadmaps

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor 20 Å, GAA, Intel, Intel 20A, PowerVia, RibbonFET

Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.

Foundries IEDM 2020 Process Technologies Subscriber Only Content

Intel Talks 10nm DTCO, EUV Benefits

June 22, 2021August 2, 2021 David Schor 10 nm, 5 nm, 7 nm, EUV, IEDM, IEDM 2020, Intel, subscriber only (general)

Intel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.

Architectures FPGAs Subscriber Only Content

Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA

June 13, 2021June 13, 2021 David Schor 16 nm, Diamond Mesa, eASIC Nextreme, Intel, Intel eASIC, Structured ASIC, subscriber only (general)

With Intel’s acquisition of eASIC in 2018, the company’s latest product – codenamed Diamond Mesa – attempts to bridge the gap between full ASIC and FPGAs.

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