Intel

Intel Talks 10nm DTCO, EUV Benefits

June 22, 2021June 22, 2021 David Schor 10 nm, 5 nm, 7 nm, EUV, IEDM, IEDM 2020, Intel, subscriber only (general)

Intel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.

Architectures FPGAs Subscriber Only Content

Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA

June 13, 2021June 13, 2021 David Schor 16 nm, Diamond Mesa, eASIC Nextreme, Intel, Intel eASIC, Structured ASIC, subscriber only (general)

With Intel’s acquisition of eASIC in 2018, the company’s latest product – codenamed Diamond Mesa – attempts to bridge the gap between full ASIC and FPGAs.

Foundries

Q1 2021 Foundry Update: Spending Bonanza

May 18, 2021May 23, 2021 David Schor 10 nm, 3 nm, 5 nm, 7 nm, FinFET, GAA, Intel, Samsung, SMIC, TSMC

A look at the current state of leading-edge foundries for the first quarter of 2021.

Architectures Graphics Processors Hot Chips 33 Mobile Processors Neural Processors Server Processors Vector Processors

Hot Chips 33 Program: Alder Lake, Sapphire Rapids, Zen 3, Next-Gen Z, Neoverse N2, And Many More

May 13, 2021May 23, 2021 David Schor AMD, ARM, Cerebras, Esperanto, Hot Chips, Hot Chips 33, Intel, Nvidia

The IEEE Symposium on High-Performance Chips Program Committee announced the program for the 2021 Hot Chips 33 conference.

Embedded Processors Mobile Processors

Intel Pushes Out Flagship Premium Tiger Lake Mobile Chips

May 13, 2021May 23, 2021 David Schor 10 nm, 11 Generation Core, Core i5, Core i7, Core i9, Intel, Tiger Lake, Willow Cove

In rolls out flagship premium performance 11th Generation Core Tiger Lake-based mobile processors with eight cores.

Architectures Server Processors

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor 10nm, AVX-512, Ice Lake, Intel, Sunny Cove, x86, Xeon Gold, Xeon Platinum, Xeon Scalable, Xeon Silver

Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the prior generation.

Architectures

The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids

June 29, 2020May 23, 2021 David Schor Advanced Matrix Extension (AMX), AI, Intel, matrices, Sapphire Rapids, x86

Intel publishes details of its upcoming Advanced Matrix Extension (AMX), an x86 extension set to debut with Sapphire Rapids that introduces a new matrix register file and accompanying matrix operations.

Mobile Processors

Intel Launches Lakefield: An Experiment With Multiple New Technologies

June 15, 2020May 23, 2021 David Schor 10 nm, 22 nm, 22FFL, 3D packaging, Core i3, Core i5, Foveros, Intel, Lakefield, Sunny Cove, Tremont

Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.

Interconnects Packaging Process Technologies

Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality

May 17, 2020May 23, 2021 David Schor 2.5D packaging, 3D packaging, Co-EMIB, EMIB, Foveros, Intel

A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.