Intel

Intel, AMD Add New Mobile Pro Processors

David SchorMobile ProcessorsApril 16, 2019 Tagged AMD, Intel, x86

This month both Intel and AMD introduced new mobile processors for business with enterprise security features.

Intel’s Spring Crest NNP-L Initial Details

David SchorArchitectures, Neural ProcessorsApril 14, 2019 Tagged 16nm, AI, Intel, Lake Crest, neural processors, NNP, NNP-I, NNP-L, Spring Crest

An initial look into Intel’s upcoming Nervana Neural Network Processor (NNP) accelerators.

Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and 112G Transceivers

David SchorFPGAsApril 2, 2019 Tagged 10nm, 112G, Agilex, DDR5, Falcon Mesa, FPGA, Intel, PCIe 4.0, PCIe 5.0

Intel has introduced their next-generation flagship data center FPGAs based on their 10-nanometer process. Utilizing a chiplet-based architecture, the company hopes to better customize the product for customer’s demand while iterating faster on PHYs and other connectivity protocols.

Intel Cascade Lake Brings Hardware Mitigations, AI Acceleration, SCM Support

David SchorArchitectures, Hot Chips 30, Server ProcessorsNovember 11, 2018 Tagged 14nm, AVX-512, AVX512VNNI, Cascade Lake, Cascade Lake AP, Cascade Lake SP, CSL, CSX, Intel, persistent memory, SCM, Skylake, storage-class memory, x86

A look at Cascade Lake, Intel’s microarchitecture for next-generation Xeon microprocessors featuring process enhancements, persistent memory support, and AI acceleration.

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Intel Discloses 9th Gen Core, Refreshes Core X, And Reintroduces STIM

David SchorArchitectures, Desktop ProcessorsOctober 14, 2018 Tagged 14nm, CFL-R, Coffee Lake, Core i5, Core i7, Core i9, Core X, Intel, Skylake, Skylake-X, Xeon W

An overview of Intel’s 9th Gen Core, new Core X processors, and the switch to STIM as well as a look at their transition from a mainstream quad-core to an octa-core.

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Hot Chips 30: Intel Kaby Lake G

David SchorCircuit Design, Hot Chips 30, PackagingSeptember 9, 2018 Tagged 14nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86

A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.

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Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures

David SchorERI Summit 2018, InterconnectsJuly 24, 2018 Tagged Advanced Interface Bus, AIB, DARPA, EMIB, Intel, interconnects, Packaging

At the DARPA 2018 ERI Summit, Intel announced their contribution of a royalty-free bus standard to DARPA’s CHIPS Program, allowing seamless communication between multiple packaged chiplets.

Intel Launches Desktop Xeon E, Their Fastest Entry-Level Workstation Processors

David SchorDesktop Processors, Server ProcessorsJuly 13, 2018 Tagged Coffee Lake, Coffee Lake E, Intel, x86, Xeon E, Xeon E3

Intel has launched their fastest entry-level workstation microprocessors based on Coffee Lake.

Core i7-8086K Overclockability Silicon Lottery Stats

David SchorDesktop ProcessorsJune 17, 2018 Tagged Coffee Lake, Core i7, Intel, Silicon Lottery, x86, Yield

Silicon Lottery has published new statistics regarding the overclockability of Intel’s hexa-core commemorative Core i7-8086K processor.

A Look at Intel’s 10nm Std Cell as TechInsights Reports on the i3-8121U, finds Ruthenium

David SchorCircuit Design, Process TechnologiesJune 15, 2018 Tagged 10nm, cobalt, Intel, Intel Custom Foundry, metallization stack, ruthenium, TechInsights

WikiChip takes another look at Intel’s 10-nanometer standard cell design and discusses TechInsights findings of the first 10nm-based chip, the i3-8121U.