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Friday, October 7, 2022
Latest:
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency
  • The NPU Inside Every Intel PC
  • SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators
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ISSCC 2022

ISSCC 2022 Organic Electronics Processors 

Reincarnating The 6502 Using Flexible TFT Tech For IoT

May 8, 2022May 8, 2022 David Schor 6502, Indium Gallium Zinc Oxide (IGZO), ISSCC, ISSCC 2022, MOS Technology 6502, Organic Electronics, Thin-film Transistor (TFT)

Can the 1970s MOS Technology 6502 find new life and new applications in the emerging world of plastic electronics?

Read more
Architectures Blockchain Processor ISSCC 2022 Processors 

Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

February 20, 2022February 21, 2022 David Schor 7 nm, ASIC, Bitcoin, blockchain accelerator, BonanzaMine, cryptocurrency, cryptocurrency mining, Intel, ISSCC, ISSCC 2022

Intel unveiled BonanzaMine, its first-generation blockchain accelerator ASIC effort.

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Top Six Articles

  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • A Look At Intel 4 Process Technology
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency
  • Arm Unveils the Cortex-A78: When Less Is More
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications
  • Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

Recent

  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

    Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

    October 7, 2022October 7, 2022 David Schor
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    October 4, 2022October 4, 2022 David Schor
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    October 1, 2022October 3, 2022 David Schor
  • The NPU Inside Every Intel PC

    The NPU Inside Every Intel PC

    September 30, 2022September 30, 2022 David Schor
  • SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

    SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

    September 20, 2022September 20, 2022 David Schor
  • N3E Replaces N3; Comes In Many Flavors

    N3E Replaces N3; Comes In Many Flavors

    September 4, 2022September 4, 2022 David Schor

Random Picks

Intel Announces Keem Bay: 3rd Generation Movidius VPU

Intel Announces Keem Bay: 3rd Generation Movidius VPU

November 12, 2019May 25, 2021 David Schor
Intel Rolls Out Cascade Lake Xeon W Processors

Intel Rolls Out Cascade Lake Xeon W Processors

June 3, 2019May 25, 2021 David Schor
Arm Launches New Neoverse N1 and E1 Server Cores

Arm Launches New Neoverse N1 and E1 Server Cores

February 20, 2019May 25, 2021 David Schor
Intel Axes Nervana Just Two Months After Launch

Intel Axes Nervana Just Two Months After Launch

February 3, 2020May 25, 2021 David Schor
Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel Launches 10th Gen Comet Lake vPro Processors

Intel Launches 10th Gen Comet Lake vPro Processors

May 13, 2020May 23, 2021 David Schor
Samsung quietly unveils their latest flagship processor: Exynos 9 Series 9810

Samsung quietly unveils their latest flagship processor: Exynos 9 Series 9810

November 10, 2017May 25, 2021 David Schor
Ranovus Odin: Co-Packaging Next-Gen DC Switches and Accelerators With Silicon Photonics

Ranovus Odin: Co-Packaging Next-Gen DC Switches and Accelerators With Silicon Photonics

April 11, 2020May 25, 2021 David Schor
Arm Cortex-X1: The First From The Cortex-X Custom Program

Arm Cortex-X1: The First From The Cortex-X Custom Program

May 26, 2020May 23, 2021 David Schor
Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds Omni-Directional Interconnects

Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds Omni-Directional Interconnects

July 9, 2019May 25, 2021 David Schor
Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

May 25, 2021May 25, 2021 David Schor
Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and 112G Transceivers

Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and 112G Transceivers

April 2, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

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