TSMC Details 5 nm
FoundriesIEDM 2019ISSCC 2020Process Technologies March 21, 2020 0
TSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.
Read more
ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow.
Read more
TSMC 5-Nanometer Update
ARM TechCon 2019FoundriesProcess Technologies November 1, 2019 0
An update on TSMC’s upcoming 5-nanometer process technology.
Read more
ASML sees strong demand for EUV systems as it starts shipping the new NXE:3400C systems to leading-edge foundries.
Read more
TSMC N7+ EUV Process Starts Shipping
Process Technologies October 7, 2019 1
TSMC announces its N7+ process which entered HVM earlier this year is now shipping products to market.
Read more
SEMICON West 2019: ASML EUV Update
SEMICON West 2019 July 21, 2019 1
An update on the current state of EUV systems which was given by ASML at SEMICON West 2019 earlier this month.
Read more
Samsung Ramps 7nm, Preps 5nm, And Adds 6nm
Process Technologies April 16, 2019 0
Samsung is announcing the completion of their 5-nanometer process design and the ramping of their 7 nm process.
Read more
TSMC Announces 6-Nanometer Process
Process Technologies April 16, 2019 0
TSMC announces the 6-nanometer process, an enhanced 7 nm EUV node.
Read more
IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors
FoundriesProcess TechnologiesRoadmapsServer Processors December 20, 2018 0
IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.
Read more
Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem
ARM TechCon 2018FoundriesPackagingProcess Technologies October 28, 2018 3
Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.
Read more- 1
- 2
-
TSMC Details 5 nm
-
ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging
-
CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor
-
A Look At The Ice Lake Thunderbolt 3 Integration
-
TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications
-
IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV
