TSMC Details 5 nm
TSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.
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EUV
ASML Q4: NXE:3400C Machines Ramp; Strong Growth Due to EUV in 2020
ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow.
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TSMC 5-Nanometer Update
An update on TSMC’s upcoming 5-nanometer process technology.
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ASML Starts NXE:3400C Shipment, But Supply Constraints Loom
ASML sees strong demand for EUV systems as it starts shipping the new NXE:3400C systems to leading-edge foundries.
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TSMC N7+ EUV Process Starts Shipping
TSMC announces its N7+ process which entered HVM earlier this year is now shipping products to market.
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SEMICON West 2019: ASML EUV Update
An update on the current state of EUV systems which was given by ASML at SEMICON West 2019 earlier this month.
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Samsung Ramps 7nm, Preps 5nm, And Adds 6nm
Samsung is announcing the completion of their 5-nanometer process design and the ramping of their 7 nm process.
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TSMC Announces 6-Nanometer Process
TSMC announces the 6-nanometer process, an enhanced 7 nm EUV node.
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IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors
IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.
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Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem
Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.
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