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  • Samsung 17nm follows Intel 16
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC
  • Samsung-Esperanto Concept AI-SSD Prototype
  • EUV State, NXE:3600D, and Pellicle Readiness and Industrialization
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EUV

Foundries IEDM 2020 Process Technologies Subscriber Only Content 

Intel Talks 10nm DTCO, EUV Benefits

June 22, 2021August 2, 2021 David Schor 10 nm, 5 nm, 7 nm, EUV, IEDM, IEDM 2020, Intel, subscriber only (general)

Intel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.

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Foundries IEDM 2019 ISSCC 2020 Process Technologies 

TSMC Details 5 nm

March 21, 2020May 25, 2021 David Schor 5 nm, 7 nm, EUV, N5, N5P, TSMC

TSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.

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Foundries 

ASML Q4: NXE:3400C Machines Ramp; Strong Growth Due to EUV in 2020

January 22, 2020May 25, 2021 David Schor ASML, EUV, High-NA, NXE:3400B, NXE:3400C

ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow.

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ARM TechCon 2019 Foundries Process Technologies 

TSMC 5-Nanometer Update

November 1, 2019May 25, 2021 David Schor 5nm, 6nm, 7nm, EUV, N5, N6, N7, TSMC

An update on TSMC’s upcoming 5-nanometer process technology.

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Foundries 

ASML Starts NXE:3400C Shipment, But Supply Constraints Loom

October 17, 2019May 25, 2021 David Schor ASML, EUV, NXE:3400B, NXE:3400C

ASML sees strong demand for EUV systems as it starts shipping the new NXE:3400C systems to leading-edge foundries.

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Process Technologies 

TSMC N7+ EUV Process Starts Shipping

October 7, 2019May 25, 2021 David Schor 7nm, EUV, N6, N7, TSMC

TSMC announces its N7+ process which entered HVM earlier this year is now shipping products to market.

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SEMICON West 2019 

SEMICON West 2019: ASML EUV Update

July 21, 2019May 25, 2021 David Schor 3nm, 5nm, 7nm, ASML, EUV, High-NA, NXE:3100, NXE:3300B, NXE:3400B

An update on the current state of EUV systems which was given by ASML at SEMICON West 2019 earlier this month.

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Process Technologies 

Samsung Ramps 7nm, Preps 5nm, And Adds 6nm

April 16, 2019May 25, 2021 David Schor 5 nm, 6 nm, EUV

Samsung is announcing the completion of their 5-nanometer process design and the ramping of their 7 nm process.

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Process Technologies 

TSMC Announces 6-Nanometer Process

April 16, 2019May 25, 2021 David Schor 6 nm, EUV, TSMC

TSMC announces the 6-nanometer process, an enhanced 7 nm EUV node.

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Foundries Process Technologies Roadmaps Server Processors 

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

December 20, 2018May 25, 2021 David Schor 7LPP, 7nm, Common Platform Alliance, EUV, IBM, POWER, Power ISA, POWER10, Samsung, Z

IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.

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  • ← Previous

Top Six Articles

  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
  • The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids
  • TSMC 2021 Foundry Update: Foundry Roadmap
  • Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp
  • AMD 3D Stacks SRAM Bumplessly

Recent

  • Samsung 17nm follows Intel 16

    Samsung 17nm follows Intel 16

    May 22, 2022May 22, 2022 David Schor
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT

    Reincarnating The 6502 Using Flexible TFT Tech For IoT

    May 8, 2022May 8, 2022 David Schor
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    February 20, 2022February 21, 2022 David Schor
  • Samsung-Esperanto Concept AI-SSD Prototype

    Samsung-Esperanto Concept AI-SSD Prototype

    November 21, 2021November 21, 2021 David Schor
  • EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

    EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

    November 20, 2021November 20, 2021 David Schor
  • Intel Launches 12th Gen Core Desktop Alder Lake Processors

    Intel Launches 12th Gen Core Desktop Alder Lake Processors

    October 27, 2021November 3, 2021 David Schor

Random Picks

Intel Announces a 5 GHz Core i7-8086K, Launches on the 40th Anniversary of the 8086

Intel Announces a 5 GHz Core i7-8086K, Launches on the 40th Anniversary of the 8086

June 5, 2018May 25, 2021 David Schor
Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019May 25, 2021 David Schor
A look at Nvidia’s NVLink interconnect and the NVSwitch

A look at Nvidia’s NVLink interconnect and the NVSwitch

May 6, 2018May 25, 2021 David Schor
Intel’s Total Memory Encryption, a new x86 extension for full memory encryption

Intel’s Total Memory Encryption, a new x86 extension for full memory encryption

December 17, 2017May 25, 2021 David Schor
Intel Launches Lakefield: An Experiment With Multiple New Technologies

Intel Launches Lakefield: An Experiment With Multiple New Technologies

June 15, 2020May 23, 2021 David Schor

Random Tags

2.5D packaging 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 12nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 edge computing EMIB EUV FinFET Foveros GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Forschungszentrum Jülich is upgrading its computing power

Forschungszentrum Jülich is upgrading its computing power

January 23, 2018May 25, 2021 Matt Larson
Cambricon Reaches for the Cloud With a Custom AI Accelerator, Talks 7nm IPs

Cambricon Reaches for the Cloud With a Custom AI Accelerator, Talks 7nm IPs

May 26, 2018May 25, 2021 David Schor
Intel silently launches Knights Mill

Intel silently launches Knights Mill

December 18, 2017May 25, 2021 David Schor
Chuck Peddle: Personal Computer Pioneer, Dies At 82

Chuck Peddle: Personal Computer Pioneer, Dies At 82

December 24, 2019May 25, 2021 David Schor
A Look at Spring Crest: Intel Next-Generation DC Training Neural Processor

A Look at Spring Crest: Intel Next-Generation DC Training Neural Processor

November 10, 2019May 25, 2021 David Schor
TSMC N7+ EUV Process Starts Shipping

TSMC N7+ EUV Process Starts Shipping

October 7, 2019May 25, 2021 David Schor
Intel Stratix 10 DX Adds PCIe Gen 4.0, Cache Coherency: UPI As Stopgap

Intel Stratix 10 DX Adds PCIe Gen 4.0, Cache Coherency: UPI As Stopgap

September 20, 2019May 25, 2021 David Schor

ARM WorldView All

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor
A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
IEDM 2020 Interconnects Packaging Subscriber Only Content 

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor
Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700
Architectures Interconnects Network-on-Chip 

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor
Arm Launches The DSU-110 For New Armv9 CPU Clusters
Architectures Interconnects Mobile Processors 

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor

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