EUV – WikiChip Fuse

ASML Starts NXE:3400C Shipment, But Supply Constraints Loom

David SchorFoundriesOctober 17, 2019 Tagged ASML, EUV, NXE:3400B, NXE:3400C

ASML sees strong demand for EUV systems as it starts shipping the new NXE:3400C systems to leading-edge foundries.

TSMC N7+ EUV Process Starts Shipping

David SchorProcess TechnologiesOctober 7, 2019 Tagged 7nm, EUV, N6, N7, TSMC

TSMC announces its N7+ process which entered HVM earlier this year is now shipping products to market.

SEMICON West 2019: ASML EUV Update

David SchorSEMICON West 2019July 21, 2019 Tagged 3nm, 5nm, 7nm, ASML, EUV, High-NA, NXE:3100, NXE:3300B, NXE:3400B

An update on the current state of EUV systems which was given by ASML at SEMICON West 2019 earlier this month.

Samsung Ramps 7nm, Preps 5nm, And Adds 6nm

David SchorProcess TechnologiesApril 16, 2019 Tagged 5 nm, 6 nm, EUV

Samsung is announcing the completion of their 5-nanometer process design and the ramping of their 7 nm process.

TSMC Announces 6-Nanometer Process

David SchorProcess TechnologiesApril 16, 2019 Tagged 6 nm, EUV, TSMC

TSMC announces the 6-nanometer process, an enhanced 7 nm EUV node.

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

David SchorFoundries, Process Technologies, Roadmaps, Server ProcessorsDecember 20, 2018 Tagged 7LPP, 7nm, Common Platform Alliance, EUV, IBM, POWER, POWER10, Samsung, Z

IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

David SchorARM TechCon 2018, Foundries, Packaging, Process TechnologiesOctober 28, 2018 Tagged 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

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VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

David SchorProcess Technologies, VLSI 2018August 4, 2018 Tagged 7LPP, 7nm, EUV, process technology, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 2nd generation 7nm process that was recently disclosed at the 38th Symposium on VLSI Technology.

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IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

David SchorIEDM 2017, Process TechnologiesDecember 21, 2017 Tagged 7LP, 7nm, AMD, EUV, FinFET, GlobalFoundries, IBM, IEDM, IEDM 2017, process technology, SADP, SAQP

At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.

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Samsung 2nd gen 10nm enters HVM, S3 fab ready for primetime

David SchorProcess TechnologiesNovember 29, 2017 Tagged 10LPP, 10nm, 7LPP, 7nm, 8LPP, 8nm, EUV, Samsung

Samsung has announced that its 2nd generation 10nm process has entered mass production. The company also announced that their S3-Line fab in South Korea is ready to ramp up production.