14 nm

Samsung 17nm follows Intel 16

May 22, 2022May 22, 2022 David Schor 14 nm, 14LPP, 17 nm, 17LPV, 28 nm, 28LPP, Intel, Intel Foundry Services (IFS), Samsung, Samsung Foundry, subscriber only (general)

Samsung follows Intel 16 with a low-cost high-performance, 17-nanometer, 17LPV node.

Neural Processors Subscriber Only Content

Inside Baidu’s In-House Neural Processor

July 11, 2021July 12, 2021 David Schor 14 nm, 14LPP, 2.5D packaging, Baidu, HBM, Kunlun, neural processors, subscriber only (general)

A peek inside Baidu’s in-house neural processor

Desktop Processors Mobile Processors

Intel Launches Entry-Level Comet Lake Xeon Ws

May 13, 2020May 23, 2021 David Schor 14 nm, Comet Lake, Intel, Xeon W

Intel launches a new series of Xeon W processors for entry-level workstations based on Comet Lake.

Desktop Processors

Intel Launches 10th Gen Comet Lake Desktop Processors

April 30, 2020May 23, 2021 David Schor 14 nm, Comet Lake, Core i3, Core i5, Core i7, Core i9, Intel

Intel launches 10th Generation Core desktop processors, formerly codename Comet Lake. The new lineup brings 22 new chips with up to 10 cores and 20 threads with turbo frequencies of up to 5.3 GHz.

Server Processors

Intel Refreshes 2nd Gen Xeon Scalable, Slashes Prices

February 27, 2020May 25, 2021 David Schor 14 nm, Cascade Lake, Cascade Lake R, Cascade Lake SP, Intel, Xeon Bronze, Xeon Gold, Xeon Platinum, Xeon Scalable, Xeon Silver

Intel refreshes its second-generation Xeon Scalable lineup mid-cycle with new mainstream dual-socket CPUs, improving the performance-per-dollar by as much as 2x over original SKUs.

Architectures Floorplanning Interconnects ISSCC 2020

7nm Boosted Zen 2 Capabilities but Doubled the Challenges

February 21, 2020May 25, 2021 David Schor 14 nm, 7 nm, AMD, capacitance, GlobalFoundries, ISSCC, ISSCC 2020, resistance, TSMC, wire delay, Zen, Zen 2

The transition to 7 nm greatly enhanced AMD silicon capabilities but introduced new drastic design challenges that required new place and route methodologies and wire engineering.

CES 2020 Mobile Processors

AMD Launches New Entry-Level Mobile ‘Dali’ Processors

January 9, 2020May 25, 2021 David Schor 14 nm, AMD, Athlon, CES 2020, Consumer Electronics Show (CES), Ryzen Mobile, Zen

AMD launches new value and entry-level mobile processors, codenamed Dali.

FPGAs Packaging

Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies

November 7, 2019May 25, 2021 David Schor 14 nm, 2.5D packaging, Advanced Interface Bus (AIB), Data Interface Bus (DIB), EMIB, FPGA, Intel, multi-chip package, Stratix 10

Intel launches the industry’s highest-capacity FPGA; 10-million LEs comprising two large FPGA dies interconnected using the company’s 2.5D EMIB packaging technology.