7nm – WikiChip Fuse

Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips

David SchorArchitectures, Desktop Processors, Roadmaps, Server ProcessorsDecember 23, 2018 Tagged 10nm, 7nm, AVX-512, Foveros, Golden Cove, Gracemont, Ice Lake, Palm Cove, Sunny Cove, Tremont, Willow Cove, x86

Last week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.

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Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes

David SchorInterconnects, Packaging, Process TechnologiesDecember 22, 2018 Tagged 10nm, 2.5D packaging, 3D packaging, 5nm, 7nm, EMIB, Foveros, heterogeneous integration, interconnects, interposer, Lakefield, multi-chip package, Packaging, x86

At the recent Intel Architecture Day, the company unveiled their latest advanced packaging technology called Foveros, a face-to-face three-dimensional (3D) die stacking packaging technology in an effort to assist with the slowing of Moore’s Law.

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IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

David SchorFoundries, Process Technologies, Roadmaps, Server ProcessorsDecember 20, 2018 Tagged 7LPP, 7nm, Common Platform Alliance, EUV, IBM, POWER, POWER10, Samsung, Z

IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.

Arm Targets Data Centers with New Roadmaps, Architectures, and Standards

David SchorArchitectures, ARM TechCon 2018, Roadmaps, Server Processors, Supercomputing 18December 16, 2018 Tagged 5nm, 7nm, Ares, ARM, data center, neoverse, Poseidon, SBBR, SBSA, ServerReady, Zeus

Arm outlines server strategy with an ambitious plan to make a dent in the data center business that is dominated by Intel through standardization and a new roadmap with high-performance ‘server-class’ cores.

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AMD Discloses Initial Zen 2 Details

David SchorArchitectures, Server ProcessorsNovember 18, 2018 Tagged 14nm, 7nm, AMD, Rome, x86, Zen, Zen 2, Zen 4

Following AMD’s recent Zen 2 and Rome disclosure, here’s a look at what has changed and what second-generation EPYC brings to the table.

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

David SchorARM TechCon 2018, Foundries, Packaging, Process TechnologiesOctober 28, 2018 Tagged 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

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VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

David SchorProcess Technologies, VLSI 2018August 4, 2018 Tagged 7LPP, 7nm, EUV, process technology, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 2nd generation 7nm process that was recently disclosed at the 38th Symposium on VLSI Technology.

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VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

David SchorVLSI 2018June 17, 2018 Tagged 10nm, 14nm, 7nm, 8nm, FinFET, GlobalFoundries, Qualcomm, Samsung, VLSI 2018, VLSI Symposium

A preview of some of the process technology papers from next week’s VLSI Symposium.

Cambricon Reaches for the Cloud With a Custom AI Accelerator, Talks 7nm IPs

David SchorNeural ProcessorsMay 26, 2018 Tagged 16nm, 7nm, accelerator, AI, Cambricon, edge computing, inference, MLU

Cambricon has announced their first high-performance and high-power AI accelerator for the data center in an effort to gain market share in the growing Chinese AI market.

AMD Tech Day: the momentum continues with new products, new prices, and 12nm and 7nm announcements

David SchorCES 2018, ProcessorsJanuary 8, 2018 Tagged 12nm, 7nm, AM4, AMD, GlobalFoundries, Navi, Radeon, Radeon Vega, Ryzen, Ryzen Mobile, Ryzen Pro, Vega, x86, Zen, Zen 2, Zen 3

As they continue on building momentum, AMD held an impressive Tech Day at CES 2018 unveiling a series of products and detailing their aggressive roadmap going forward.

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