7nm – WikiChip Fuse

TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC

David SchorInterconnects, Packaging, Server Processors, VLSI 2019June 22, 2019 Tagged 7nm, ARM, ARMv8, chiplet, Cortex-A72, CoWoS, LIPINCON, VLSI 2019, VLSI Symposium

A look at a high-performance 7nm Arm-based chiplet architecture which was recently presented by TSMC at the 2019 VLSI Symposium.

TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO

David SchorProcess Technologies, VLSI 2019June 16, 2019 Tagged 7HPC, 7nm, FinFET, SDM845, SDM855, Snapdragon 800, Snapdragon 855, TSMC, VLSI 2019, VLSI Symposium

Update and analysis of TSMC 7-nanometer node low-power and high-performance cells, 2nd generation 7nm, and the design technology co-optimization (DTCO) effort that went into the Snapdragon 855 SoC.

Pages: 1 2

Leaked Intel Server Roadmap Shows Sapphire Rapids With DDR5/PCIe 5.0 For 2021, Granite Rapids For 2022

David SchorRoadmapsMay 21, 2019 Tagged 10nm, 7nm, Cooper Lake, Granite Rapids, Ice Lake, Sapphire Rapids, x86

A leaked roadmap of Intel server processors reveals some new details about their next-generation Sapphire Rapids and Granite Rapids processors.

Ice Lake Brings A New CPU, GPU, IPU, and I/Os, To Follow By Tiger Lake Next Year

David SchorArchitectures, Floorplanning, Mobile ProcessorsMay 12, 2019 Tagged 10nm, 7nm, AVX-512, Gen11, Ice Lake, Sapphire Rapids, Tiger Lake

A look at Ice Lake mobile CPUs which bring a new CPU core, a new Gen11 GPU, and a new 4th Gen IPU as well the new roadmap detailed by Intel at their recent investor meeting which includes Xeon Sapphire Rapids CPUs and 7nm Xe Data Center GPGPUs for 2021.

Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021

David SchorFoundries, Interconnects, Packaging, Process TechnologiesMay 11, 2019 Tagged 10nm, 3D packaging, 7nm, EMIB, HPC, Lakefield

An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.

Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen

David SchorArchitectures, Server ProcessorsMay 3, 2019 Tagged 7HPC, 7nm, ARM, ARMv8.2, Hi1620, Hi1630, HiSilicon, Huawei, Kunpeng, TaiShan

Last week Huawei expanded their Kunpeng CPU family of custom Arm server processors with more models and new servers.

Arm Launches New Neoverse N1 and E1 Server Cores

David SchorArchitectures, Embedded Processors, Manycore Processors, Server ProcessorsFebruary 20, 2019 Tagged 7nm, AI, Ares, ARM, ARMv8, E1, edge computing, hyperscalers, N1, neoverse, Supercomputers

Affirming their commitment to infrastructure, Arm is launching two new server-grade platforms – the Neoverse N1 and E1. The new platforms are designed to offer new Arm-based high-performance compute and high-throughput performance IP options.

Pages: 1 2 3

Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips

David SchorArchitectures, Desktop Processors, Roadmaps, Server ProcessorsDecember 23, 2018 Tagged 10nm, 7nm, AVX-512, Foveros, Golden Cove, Gracemont, Ice Lake, Palm Cove, Sunny Cove, Tremont, Willow Cove, x86

Last week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.

Pages: 1 2

Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes

David SchorInterconnects, Packaging, Process TechnologiesDecember 22, 2018 Tagged 10nm, 2.5D packaging, 3D packaging, 5nm, 7nm, EMIB, Foveros, heterogeneous integration, interconnects, interposer, Lakefield, multi-chip package, Packaging, x86

At the recent Intel Architecture Day, the company unveiled their latest advanced packaging technology called Foveros, a face-to-face three-dimensional (3D) die stacking packaging technology in an effort to assist with the slowing of Moore’s Law.

Pages: 1 2

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

David SchorFoundries, Process Technologies, Roadmaps, Server ProcessorsDecember 20, 2018 Tagged 7LPP, 7nm, Common Platform Alliance, EUV, IBM, POWER, POWER10, Samsung, Z

IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.