SemiConWest

TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging

Packaging Process Technologies SEMICON West 2019 VLSI 2019 July 28, 2019 3

An update on TSMC current and forthcoming logic process nodes as well as their next-generation advanced packaging technologies.

Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds Omni-Directional Interconnects

Interconnects Packaging July 9, 2019 2

Intel is expanding its packaging portfolio with more advanced 2.5D and 3D technologies including multiple 3D stacks and omnidirectional interconnects.