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Wednesday, October 5, 2022
Latest:
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency
  • The NPU Inside Every Intel PC
  • SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators
  • N3E Replaces N3; Comes In Many Flavors
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6nm

ARM TechCon 2019 Foundries Process Technologies 

TSMC 5-Nanometer Update

November 1, 2019May 25, 2021 David Schor 5nm, 6nm, 7nm, EUV, N5, N6, N7, TSMC

An update on TSMC’s upcoming 5-nanometer process technology.

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Packaging Process Technologies SEMICON West 2019 VLSI 2019 

TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging

July 28, 2019May 25, 2021 David Schor 3D packaging, 3nm, 5nm, 6nm, 7nm, CoWoS, InFO, InFO_AiP, InFO_MS, InFO_oS, N5, N5P, N6, N7, N7P, SemiConWest, SoIC, TSMC, VLSI 2019, VLSI Symposium

An update on TSMC current and forthcoming logic process nodes as well as their next-generation advanced packaging technologies.

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Top Six Articles

  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency
  • SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators
  • A Look At Intel 4 Process Technology
  • N3E Replaces N3; Comes In Many Flavors
  • The NPU Inside Every Intel PC

Recent

  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    October 4, 2022October 4, 2022 David Schor
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    October 1, 2022October 3, 2022 David Schor
  • The NPU Inside Every Intel PC

    The NPU Inside Every Intel PC

    September 30, 2022September 30, 2022 David Schor
  • SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

    SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

    September 20, 2022September 20, 2022 David Schor
  • N3E Replaces N3; Comes In Many Flavors

    N3E Replaces N3; Comes In Many Flavors

    September 4, 2022September 4, 2022 David Schor
  • Samsung Foundry On EUV, Pellicles, Capacity, and Yield

    Samsung Foundry On EUV, Pellicles, Capacity, and Yield

    July 25, 2022July 25, 2022 David Schor

Random Picks

IEDM 2017: AMD’s grand vision for the future of HPC

IEDM 2017: AMD’s grand vision for the future of HPC

December 5, 2017May 25, 2021 David Schor
Esperanto exits stealth mode, aims at AI with a 4,096-core 7nm RISC-V monster

Esperanto exits stealth mode, aims at AI with a 4,096-core 7nm RISC-V monster

January 1, 2018May 25, 2021 David Schor
The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids

The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids

June 29, 2020May 23, 2021 David Schor
GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

September 21, 2019June 11, 2021 David Schor
Intel’s Total Memory Encryption, a new x86 extension for full memory encryption

Intel’s Total Memory Encryption, a new x86 extension for full memory encryption

December 17, 2017May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

May 25, 2021May 25, 2021 David Schor
Intel Launches Mainstream Cascade Lake Xeon W Workstation Processors

Intel Launches Mainstream Cascade Lake Xeon W Workstation Processors

October 7, 2019May 25, 2021 David Schor
Inside Baidu’s In-House Neural Processor

Inside Baidu’s In-House Neural Processor

July 11, 2021July 12, 2021 David Schor
Intel Rolls Out Next-Gen Data Center Portfolio; 100 Gigabit Ethernet, Optane DC, Hewitt Lake, and Cascade Lake With Up to 56 Cores

Intel Rolls Out Next-Gen Data Center Portfolio; 100 Gigabit Ethernet, Optane DC, Hewitt Lake, and Cascade Lake With Up to 56 Cores

April 2, 2019May 25, 2021 David Schor
IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

December 20, 2018May 25, 2021 David Schor
Intel Axes Nervana Just Two Months After Launch

Intel Axes Nervana Just Two Months After Launch

February 3, 2020May 25, 2021 David Schor
A Look at Spring Crest: Intel Next-Generation DC Training Neural Processor

A Look at Spring Crest: Intel Next-Generation DC Training Neural Processor

November 10, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

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