WikiChip Fuse

Arm Targets Data Centers with New Roadmaps, Architectures, and Standards

David SchorArchitectures, ARM TechCon 2018, Roadmaps, Server Processors, Supercomputing 18December 16, 2018 Tagged 5nm, 7nm, Ares, ARM, data center, neoverse, Poseidon, SBBR, SBSA, ServerReady, Zeus

Arm outlines server strategy with an ambitious plan to make a dent in the data center business that is dominated by Intel through standardization and a new roadmap with high-performance ‘server-class’ cores.

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A Look at NEC’s Latest Vector Processor, the SX-Aurora

David SchorArchitectures, Hot Chips 30, Server Processors, Supercomputing 18December 9, 2018 Tagged 16nm, 3D packaging, HBM2, interposer, multi-chip package, NEC, Packaging, SIMD, SX series, SX-Aurora, vector processors

A look at the NEC SX-Aurora, their latest vector processor – increasing compute while maintaining a high B/F through six HBM2 modules leveraging TSMC 2nd gen CoWoS technology. The SX-Aurora introduces a new form factor, system architecture, and execution model.

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AMD Discloses Initial Zen 2 Details

David SchorArchitectures, Server ProcessorsNovember 18, 2018 Tagged 14nm, 7nm, AMD, Rome, x86, Zen, Zen 2, Zen 4

Following AMD’s recent Zen 2 and Rome disclosure, here’s a look at what has changed and what second-generation EPYC brings to the table.

Intel Cascade Lake Brings Hardware Mitigations, AI Acceleration, SCM Support

David SchorArchitectures, Hot Chips 30, Server ProcessorsNovember 11, 2018 Tagged 14nm, AVX-512, AVX512VNNI, Cascade Lake, Cascade Lake AP, Cascade Lake SP, CSL, CSX, Intel, persistent memory, SCM, Skylake, storage-class memory, x86

A look at Cascade Lake, Intel’s microarchitecture for next-generation Xeon microprocessors featuring process enhancements, persistent memory support, and AI acceleration.

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SiFive Launches 7 Series, Their Highest Performance RISC-V Cores

David SchorArchitectures, Embedded Processors, Mobile ProcessorsNovember 8, 2018 Tagged RISC-V, SiFive

SiFive launches 7 Series, their highest-performance RISC-V cores.

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

David SchorARM TechCon 2018, Foundries, Packaging, Process TechnologiesOctober 28, 2018 Tagged 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

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Intel Discloses 9th Gen Core, Refreshes Core X, And Reintroduces STIM

David SchorArchitectures, Desktop ProcessorsOctober 14, 2018 Tagged 14nm, CFL-R, Coffee Lake, Core i5, Core i7, Core i9, Core X, Intel, Skylake, Skylake-X, Xeon W

An overview of Intel’s 9th Gen Core, new Core X processors, and the switch to STIM as well as a look at their transition from a mainstream quad-core to an octa-core.

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