WikiChip Fuse

Our latest coverage from the chip architecture world, including announced and planned as well as recently launched products.

Architectures Foundries

Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

October 7, 2022October 7, 2022 David Schor

Intel, SiFive demonstrated high-performance RISC-V Horse Creek development platform on Intel 4 Process.

Architectures Desktop Processors Mobile Processors

Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

October 1, 2022October 3, 2022 David Schor

Intel rolls out 13th Generation Core, “Raptor Lake” client processors; cranks up the frequency.

Architectures Neural Processors Subscriber Only Content

The NPU Inside Every Intel PC

September 30, 2022September 30, 2022 David Schor

[Subscription] A look at the neural processor inside every Intel processor.

AI Hardware Summit Architectures Embedded Processors Interconnects Linley Processor Conference Neural Processors

SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

September 20, 2022September 20, 2022 David Schor

SiFive introduces a new high-performance coprocessor interface targeting custom accelerators; scores design wins from Google, NASA.

Embedded Processors Mobile Processors Roadmaps Server Processors

SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

November 1, 2022November 2, 2022 David Schor P470, P670, RISC-V, SiFive

SiFive announces new high-performance RISC-V cores, bifurcating the Performance family into performance and efficiency cores.

Architectures Foundries

Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

October 7, 2022October 7, 2022 David Schor Cadence, Intel, Intel 4, Intel Foundry Services (IFS), Intel Innovation 2022, RISC-V, SiFive, Synopsys

Intel, SiFive demonstrated high-performance RISC-V Horse Creek development platform on Intel 4 Process.

Packaging Subscriber Only Content

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor 2.5D packaging, 3D packaging, HPC, hybrid bonding, SoIC, SoIC_H, SRAM cube, subscriber only (general), TSMC

[Subscription] TSMC demonstrates SoIC_H for next-generation high-bandwidth HPC applications.

Architectures Desktop Processors Mobile Processors

Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

October 1, 2022October 3, 2022 David Schor 13 Generation Core, 7 nm, Alder Lake, Intel, Intel 7, Intel Core, Intel Innovation 2022, Raptor Cove, Raptor Lake

Intel rolls out 13th Generation Core, “Raptor Lake” client processors; cranks up the frequency.

Architectures Neural Processors Subscriber Only Content

The NPU Inside Every Intel PC

September 30, 2022September 30, 2022 David Schor Intel, subscriber only (general)

[Subscription] A look at the neural processor inside every Intel processor.

AI Hardware Summit Architectures Embedded Processors Interconnects Linley Processor Conference Neural Processors

SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

September 20, 2022September 20, 2022 David Schor AI, AI Hardware Summit, Linley Processor Conference, neural processors, SiFive, Vector Coprocessor Interface Extension (VCIX)

SiFive introduces a new high-performance coprocessor interface targeting custom accelerators; scores design wins from Google, NASA.

Process Technologies

N3E Replaces N3; Comes In Many Flavors

September 4, 2022September 4, 2022 David Schor 3 nm, FinFlex, N3, N3E, TSMC

TSMC outlines a number of 3-nanometer class node changes and flavors.

Foundries Roadmaps Subscriber Only Content

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor 4 nm, 5 nm, Extreme Ultraviolet (EUV) Lithography, Samsung, Samsung Foundry, subscriber only (general)

Samsung Foundry talks about EUV, wafer capacity and mid-term plans,pPellicles, and advanced node yield.

Foundries Process Technologies Roadmaps

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor 2 nm, 3 nm, 3GAAE, 3GAAP, 3GAE, 3GAP, 5LPE, GAAFET, nanosheet, Samsung, Samsung Foundry

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

Architectures Mobile Processors

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor ARM, ARMv9, Cortex, Cortex-A, Cortex-A510

Arm refreshes the Cortex-A510 core, squeezes higher efficiency.

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