Ice Lake Brings A New CPU, GPU, IPU, and I/Os, To Follow By Tiger Lake Next Year
Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021
Intel’s Spring Crest NNP-L Initial Details
Intel Rolls Out Next-Gen Data Center Portfolio
Arm Launches New Neoverse N1 and E1 Server Cores
Intel Reveals 10nm Sunny Cove, New Roadmaps, and Ice Lake Chips
Intel Details Foveros, A High-Performance 3D Die Stacking Technology
Arm Targets Data Centers With New Roadmaps, Architectures, and Standards
A Look at the NEC SX-Aurora Vector Processor
AMD Discloses Initial Zen 2 Details
A look at Ice Lake mobile CPUs which bring a new CPU core, a new Gen11 GPU, and a new 4th Gen IPU as well the new roadmap detailed by Intel at their recent investor meeting which includes Xeon Sapphire Rapids CPUs and 7nm Xe Data Center GPGPUs for 2021.
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An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.
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Last week Huawei expanded their Kunpeng CPU family of custom Arm server processors with more models and new servers.
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This month both Intel and AMD introduced new mobile processors for business with enterprise security features.
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Samsung is announcing the completion of their 5-nanometer process design and the ramping of their 7 nm process.
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TSMC announces the 6-nanometer process, an enhanced 7 nm EUV node.
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An initial look into Intel’s upcoming Nervana Neural Network Processor (NNP) accelerators.
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TSMC 5-nanometer node has entered risk production with PDKs available for production design. Here’s is our initial density estimates.
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Intel has introduced their next-generation flagship data center FPGAs based on their 10-nanometer process. Utilizing a chiplet-based architecture, the company hopes to better customize the product for customer’s demand while iterating faster on PHYs and other connectivity protocols.
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