Intel Launches New Comet Lake 10th Gen Mobile Processors With More Cores, LPDDR4X Memory
Intel launches new high-performance mobile 10th Generation processors based on the Comet Lake microarchitecture.
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A Look At The AMD Zen 2 Core
TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO
Intel Sunny Cove Core To Deliver A Major Improvement In Single-Thread Performance, Bigger Improvements To Follow
Arm Unveils Cortex-A77, Emphasizes Single-Thread Performance
Ice Lake Brings A New CPU, GPU, IPU, and I/Os, To Follow By Tiger Lake Next Year
Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021
Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen
Intel’s Spring Crest NNP-L Initial Details
Intel Rolls Out Next-Gen Data Center Portfolio
Arm Launches New Neoverse N1 and E1 Server Cores
A Look At The Ice Lake Thunderbolt 3 Integration
At look the Ice Lake Thunderbolt 3 integration, Intel’s biggest integration since the graphics on Sandy Bridge.
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DARPA ERI: HIVE and Intel PUMA Graph Processor
An update on the DAPRA HIVE program and the first disclosure of Intel’s Graph Analytics (GA) processor that is currently under development
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Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips
Intel launches 10th Generation Core based on the Ice Lake microarchitecture with a lineup of 11 new mobile chips with a turbo of up to 4.1 GHz
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SEMICON West 2019: ASML EUV Update
An update on the current state of EUV systems which was given by ASML at SEMICON West 2019 earlier this month.
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DARPA ERI: How Ayar Labs Collaboration With GF Produces A Photonics Chiplet That Can Supercharge Intel FPGAs
From a DARPA vision and a $15 million seed to a commercialized CMOS silicon photonics product: how Ayar Labs collaboration with GF produces a photonics chiplet that can supercharge Intel FPGAs.
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Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons
Intel announced Pohoiki Beach and Pohoiki Springs, two new research neuromorphic systems capable of scaling from 64 to 768 Loihi chips with 8 million to 100 million neurons per system.
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Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds Omni-Directional Interconnects
Intel is expanding its packaging portfolio with more advanced 2.5D and 3D technologies including multiple 3D stacks and omnidirectional interconnects.
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