WikiChip Fuse – Your Chips and Semi News

Hot Chips 30: IBM Details POWER9 Scale-Up

Hot Chips 30: Nvidia's Tegra Xavier

Samsung's 2nd Generation 7nm

IEDM 2017 ISSCC 2018: Intel's 10nm with cobalt interconnects

AMD’s Zen CPU Complex, Cache, and SMU

Intel Cascade Lake Brings Hardware Mitigations, AI Acceleration, SCM Support

David SchorArchitectures, Hot Chips 30, Server ProcessorsNovember 11, 2018 Tagged 14nm, AVX-512, AVX512VNNI, Cascade Lake, Cascade Lake AP, Cascade Lake SP, CSL, CSX, Intel, persistent memory, SCM, Skylake, storage-class memory, x86

A look at Cascade Lake, Intel’s microarchitecture for next-generation Xeon microprocessors featuring process enhancements, persistent memory support, and AI acceleration.

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SiFive Launches 7 Series, Their Highest Performance RISC-V Cores

David SchorArchitectures, Embedded Processors, Mobile ProcessorsNovember 8, 2018 Tagged RISC-V, SiFive

SiFive launches 7 Series, their highest-performance RISC-V cores.

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

David SchorARM TechCon 2018, Foundries, Packaging, Process TechnologiesOctober 28, 2018 Tagged 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

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Intel Discloses 9th Gen Core, Refreshes Core X, And Reintroduces STIM

David SchorArchitectures, Desktop ProcessorsOctober 14, 2018 Tagged 14nm, CFL-R, Coffee Lake, Core i5, Core i7, Core i9, Core X, Intel, Skylake, Skylake-X, Xeon W

An overview of Intel’s 9th Gen Core, new Core X processors, and the switch to STIM as well as a look at their transition from a mainstream quad-core to an octa-core.

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POWER9 Scales Up To 1.2 TB/s of I/O, Targets NVLink 3, OpenCAPI Memory for 2019

David SchorArchitectures, Floorplanning, Hot Chips 30, Interconnects, Server ProcessorsOctober 7, 2018 Tagged 14HP, 14nm, A-Bus, Centaur, Hot Chips, Hot Chips 30, IBM, NVLink, OpenCAPI, POWER, POWER9, PowerAXON, X-Bus

A look at the IBM POWER9 scale-up design recently disclosed at Hot Chips 30 and their plans for a 3rd POWER9 derivative for 2019.

BrainChip Discloses Akida, A Neuromorphic SoC

David SchorArchitectures, Embedded Processors, Server ProcessorsSeptember 28, 2018 Tagged AI, Akida, BrainChip, neural processors, neuromorphic chip, spiking neural network

BrainChip discloses Akida, a Neuromorphic System-on-Chip for the edge and server.

Nantero’s NRAM, A Universal Memory Candidate?

David SchorHot Chips 30, Interconnects, Process TechnologiesSeptember 22, 2018 Tagged 28nm, carbon nanotube, carbon nanotubes, CNTs, Nantero, non-volatile memory, NRAM, process technology, storage-class memory

Presented at Hot Chips 30, a look at Nantero’s NRAM, a high-performance carbon nanotube-based memory billed as a DRAM successor.

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Ampere Ships First Gen ARM Server Processors

David SchorServer ProcessorsSeptember 19, 2018 Tagged 16FF+, 16nm, Ampere Computing, ARM, ARMv8, Skylark, X-Gene

Partnering up with Lenovo, ARM server startup Ampere has announced their first-generation eMAG microprocessors are now shipping.

Hot Chips 30: Intel Kaby Lake G

David SchorCircuit Design, Hot Chips 30, PackagingSeptember 9, 2018 Tagged 14nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86

A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.

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Hot Chips 30: Nvidia Xavier SoC

David SchorArchitectures, Floorplanning, Hot Chips 30September 8, 2018 Tagged 12FFN, 12nm, AI, ARM, ARMv8, neural processors, Nvidia, NVLink, Tegra, Xavier

An overview of the Xavier SoC which was detailed by Nvidia at Hot Chips 30.