Your Chips and Semi News
Our latest coverage from the chip architecture world, including announced and planned as well as recently launched products.
Intel publishes details of its upcoming Advanced Matrix Extension (AMX), an x86 extension set to debut with Sapphire Rapids that introduces a new matrix register file and accompanying matrix operations.
A look at the new Cortex-M55, an embedded ARMv8 core with the new Helium vector extension.
Arm unveils the Cortex-A78 microarchitecture for next-generation flagship smartphones.
Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program.
Our latest coverage from the semiconductor world including recent announcements and analysis of new process nodes from semiconductor foundries including Intel, TSMC, Samsung, GlobalFoundries, and other.
A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.
The latest chip-related news from the world of HPC and supercomputers.
Arm updates its Neoverse roadmap with the Neoverse N2 and V1, introducing SVE support for the first time as well as bfloat16 operations. Like the Cortex-X series, the Neoverse V-series will ease its power and area constraints in favor of higher performance.
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Intel publishes details of its upcoming Advanced Matrix Extension (AMX), an x86 extension set to debut with Sapphire Rapids that introduces a new matrix register file and accompanying matrix operations.
Read more
A look at the new Cortex-M55, an embedded ARMv8 core with the new Helium vector extension.
Read more
Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.
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Arm unveils the Cortex-A78 microarchitecture for next-generation flagship smartphones.
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Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program.
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IBM releases Power ISA v3.1. Among the new instructions, there is new bfloat16 support, new reduced-precision outer-product operations including 4-bit integers, and new instruction prefixes. IBM plans on presenting POWER10 at Hot Chips 32.
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A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.
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NEC readies 2nd-generation Vector Engine, Type 20, offering higher memory bandwidth and a few more vector cores.
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TSMC announces its intention to build and operate an advanced 5-nanometer fab in Arizona.
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