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Intel’s Spring Crest NNP-L Initial Details

Intel Rolls Out Next-Gen Data Center Portfolio

Arm Launches New Neoverse N1 and E1 Server Cores

Intel Reveals 10nm Sunny Cove, New Roadmaps, and Ice Lake Chips

Intel Details Foveros, A High-Performance 3D Die Stacking Technology

Arm Targets Data Centers With New Roadmaps, Architectures, and Standards

A Look at the NEC SX-Aurora Vector Processor

AMD Discloses Initial Zen 2 Details

Hot Chips 30: IBM Details POWER9 Scale-Up

Intel, AMD Add New Mobile Pro Processors

David SchorMobile ProcessorsApril 16, 2019 Tagged AMD, Intel, x86

This month both Intel and AMD introduced new mobile processors for business with enterprise security features.

Samsung Ramps 7nm, Preps 5nm, And Adds 6nm

David SchorProcess TechnologiesApril 16, 2019 Tagged 5 nm, 6 nm, EUV

Samsung is announcing the completion of their 5-nanometer process design and the ramping of their 7 nm process.

TSMC Announces 6-Nanometer Process

David SchorProcess TechnologiesApril 16, 2019 Tagged 6 nm, EUV, TSMC

TSMC announces the 6-nanometer process, an enhanced 7 nm EUV node.

Intel’s Spring Crest NNP-L Initial Details

David SchorArchitectures, Neural ProcessorsApril 14, 2019 Tagged 16nm, AI, Intel, Lake Crest, neural processors, NNP, NNP-I, NNP-L, Spring Crest

An initial look into Intel’s upcoming Nervana Neural Network Processor (NNP) accelerators.

TSMC Starts 5-Nanometer Risk Production

David SchorProcess TechnologiesApril 6, 2019 Tagged 5 nm, 7 nm, FinFET, risk production, TSMC

TSMC 5-nanometer node has entered risk production with PDKs available for production design. Here’s is our initial density estimates.

Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and 112G Transceivers

David SchorFPGAsApril 2, 2019 Tagged 10nm, 112G, Agilex, DDR5, Falcon Mesa, FPGA, Intel, PCIe 4.0, PCIe 5.0

Intel has introduced their next-generation flagship data center FPGAs based on their 10-nanometer process. Utilizing a chiplet-based architecture, the company hopes to better customize the product for customer’s demand while iterating faster on PHYs and other connectivity protocols.

Intel Rolls Out Next-Gen Data Center Portfolio; 100 Gigabit Ethernet, Optane DC, Hewitt Lake, and Cascade Lake With Up to 56 Cores

David SchorArchitectures, Embedded Processors, Server ProcessorsApril 2, 2019 Tagged 14nm, 800 Series Ethernet, Cascade Lake, Columbiaville, data center, Hewitt Lake, Optane DC, Skylake-SP, Speed Select Technology, x86, Xeon Bronze, Xeon D, Xeon Gold, Xeon Platinum, Xeon Scalable, Xeon Silver

Intel is launching their next-generation data center infrastructure product portfolio including Cascade Lake with up to 56 cores, new lower-power Hewitt Lake processors, Optane DC SSD and persistent memory DIMMs, as well as 100 Gb Ethernet.

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Arm Announces a New Security Certification Program for IoT Devices

David SchorEmbedded ProcessorsFebruary 25, 2019 Tagged ARM, IoT, physical attack, Platform Security Architecture, PSA, Security, software attack

Arm has announced the PSA Certified program, a new and independent certification program for IoT devices that implement the platform security architecture (PSA).

Arm Launches New Neoverse N1 and E1 Server Cores

David SchorArchitectures, Embedded Processors, Manycore Processors, Server ProcessorsFebruary 20, 2019 Tagged 7nm, AI, Ares, ARM, ARMv8, E1, edge computing, hyperscalers, N1, neoverse, Supercomputers

Affirming their commitment to infrastructure, Arm is launching two new server-grade platforms – the Neoverse N1 and E1. The new platforms are designed to offer new Arm-based high-performance compute and high-throughput performance IP options.

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Samsung Discloses Exynos M4 Changes, Upgrades Support for ARMv8.2, Rearranges The Back-End

David SchorArchitectures, Mobile ProcessorsJanuary 14, 2019 Tagged 8LPP, ARM, ARMv8, ARMv8.2, Exynos, Samsung

Samsung details the initial changes to the Exynos M4 core found in the Exynos 9820 which will be in Samsung’s next-generation Galaxy S10 smartphone.