Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles
Samsung tapes out 3nm GAA test vehicle as it inches towards mass production
Read moreSamsung tapes out 3nm GAA test vehicle as it inches towards mass production
Read moreIBM doubles its 14-nanometer eDRAM density through physical design work, enabling the packing of hundreds of additional megabytes of cache on the latest z15 microprocessor and system controller.
Read moreCEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.
Read moreA look at AMD’s Radeon RX 5700 GPU built on a 7-nanometer process based on the new Navi microarchitecture and RDNA graphics architecture.
Read moreIntegrated photonics has long been considered a holy grail for communication. Ayar Labs TeraPHY chiplet represents a major step forward through the co-packaging of the optical interface along with an SoC.
Read moreA look at the 496-core RISC-V manycore array, network-on-chip, and the digital PLL of the Celerity open-source RISC-V tiered accelerator.
Read moreFrom a DARPA vision and a $15 million seed to a commercialized CMOS silicon photonics product: how Ayar Labs collaboration with GF produces a photonics chiplet that can supercharge Intel FPGAs.
Read morePresented at the 64th IEEE International Electron Devices Meeting (IEDM) in December, here’s a look at Intel’s 10-nanometer standard cell library and power delivery system.
Read moreA look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.
Read moreOverview of AMD Raven Ridge APUs that were recently detailed at Hot Chips 30.
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