Kaby Lake

Hot Chips 30: Intel Kaby Lake G

David SchorCircuit Design, Hot Chips 30, PackagingSeptember 9, 2018 Tagged 14nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86

A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.

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Intel launches 8th Gen Core with Radeon RX Vega Graphics

David SchorCES 2018, Mobile ProcessorsJanuary 7, 2018 Tagged 14nm, AMD, EMIB, GPU, HBM, Intel, Kaby Lake, Radeon, x86

At CES 2018 Intel announced the first series of the much anticipated Core i5 and i7 chips with Radeon graphics. Those parts incorporate a Kaby Lake microprocessor, a Vega M GPU, and 4 GiB of HBM2 cache.