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Wednesday, November 29, 2023
Latest:
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
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Roadmaps

Embedded Processors Mobile Processors Roadmaps Server Processors 

SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

November 1, 2022November 2, 2022 David Schor P470, P670, RISC-V, SiFive

SiFive announces new high-performance RISC-V cores, bifurcating the Performance family into performance and efficiency cores.

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Foundries Roadmaps Subscriber Only Content 

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor 4 nm, 5 nm, Extreme Ultraviolet (EUV) Lithography, Samsung, Samsung Foundry, subscriber only (general)

Samsung Foundry talks about EUV, wafer capacity and mid-term plans,pPellicles, and advanced node yield.

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Foundries Process Technologies Roadmaps 

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor 2 nm, 3 nm, 3GAAE, 3GAAP, 3GAE, 3GAP, 5LPE, GAAFET, nanosheet, Samsung, Samsung Foundry

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

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Foundries Process Technologies Roadmaps Subscriber Only Content 

EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

November 20, 2021November 20, 2021 David Schor ASML, Extreme Ultraviolet (EUV) Lithography, High-NA, subscriber only (general)

A look at the current state of EUV machines, the new NXE:3600D, and EUV pellicle readiness and industrialization.

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Foundries Process Technologies Roadmaps 

TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

October 26, 2021October 26, 2021 David Schor 5 nm, Extreme Ultraviolet (EUV) Lithography, FinFET, N4, N4P, N5, TSMC

TSMC introduces a new 5-nanometer derivative – an enhanced performance N4P node.

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Packaging Roadmaps 

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor 3D packaging, die stacking, EMIB, Foveros, Intel

Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding

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Foundries Process Technologies Roadmaps 

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor Extreme Ultraviolet (EUV) Lithography, Intel, Intel 20A, Intel 3, Intel 4, Intel 7

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

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Foundries Process Technologies Roadmaps 

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor 20 Å, GAA, Intel, Intel 20A, PowerVia, RibbonFET

Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.

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Circuit Design Foundries ISSCC 2021 Process Technologies Roadmaps Subscriber Only Content VLSI 2021 

Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles

July 8, 2021July 8, 2021 David Schor 3 nm, GAA, Samsung, Samsung Foundry, subscriber only (general)

Samsung tapes out 3nm GAA test vehicle as it inches towards mass production

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Foundries Process Technologies Roadmaps Subscriber Only Content 

TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap

July 6, 2021July 6, 2021 David Schor 5 nm, 7 nm, HPC, N5A, N5HPC, N6RF, N7HPC, subscriber only (general)

A TSMC 2021 foundry update: automotive, networking, and HPC roadmap.

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  • ← Previous

Top Six Articles

  • A Look At Intel 4 Process Technology
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
  • Arm Unveils the Cortex-A78: When Less Is More
  • Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

Recent

  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor

Random Picks

Reincarnating The 6502 Using Flexible TFT Tech For IoT

Reincarnating The 6502 Using Flexible TFT Tech For IoT

May 8, 2022May 8, 2022 David Schor
Inside Baidu’s In-House Neural Processor

Inside Baidu’s In-House Neural Processor

July 11, 2021July 12, 2021 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
AMD Announces Threadripper 2, Chiplets Aid Core Scaling

AMD Announces Threadripper 2, Chiplets Aid Core Scaling

August 7, 2018May 25, 2021 David Schor
TSMC N7+ EUV Process Starts Shipping

TSMC N7+ EUV Process Starts Shipping

October 7, 2019May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

MediaTek Announces The Helio P22, A New Premium Mid-Range SoC

MediaTek Announces The Helio P22, A New Premium Mid-Range SoC

May 25, 2018May 25, 2021 Matt Larson
TOP500 50th List Anniversary: A Visualized Breakdown

TOP500 50th List Anniversary: A Visualized Breakdown

November 14, 2017May 25, 2021 David Schor
Leaked Intel Server Roadmap Shows Sapphire Rapids With DDR5/PCIe 5.0 For 2021, Granite Rapids For 2022

Leaked Intel Server Roadmap Shows Sapphire Rapids With DDR5/PCIe 5.0 For 2021, Granite Rapids For 2022

May 21, 2019May 25, 2021 David Schor
Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips

Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips

August 1, 2019May 25, 2021 David Schor
Intel Rolls Out Cascade Lake Xeon W Processors

Intel Rolls Out Cascade Lake Xeon W Processors

June 3, 2019May 25, 2021 David Schor
Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

October 1, 2022October 3, 2022 David Schor
A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor

ARM WorldView All

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor

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