SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores
SiFive announces new high-performance RISC-V cores, bifurcating the Performance family into performance and efficiency cores.
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Roadmaps
Samsung Foundry On EUV, Pellicles, Capacity, and Yield
Samsung Foundry talks about EUV, wafer capacity and mid-term plans,pPellicles, and advanced node yield.
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Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
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EUV State, NXE:3600D, and Pellicle Readiness and Industrialization
A look at the current state of EUV machines, the new NXE:3600D, and EUV pellicle readiness and industrialization.
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TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
TSMC introduces a new 5-nanometer derivative – an enhanced performance N4P node.
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Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding
Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding
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Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
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Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp
Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.
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Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles
Samsung tapes out 3nm GAA test vehicle as it inches towards mass production
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TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap
A TSMC 2021 foundry update: automotive, networking, and HPC roadmap.
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