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Latest:
  • A Look At Samsung’s 4LPE Process
  • A Look At Intel 4 Process Technology
  • Samsung 17nm follows Intel 16
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC
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Roadmaps

Foundries Process Technologies Roadmaps Subscriber Only Content 

EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

November 20, 2021November 20, 2021 David Schor ASML, Extreme Ultraviolet (EUV) Lithography, High-NA, subscriber only (general)

A look at the current state of EUV machines, the new NXE:3600D, and EUV pellicle readiness and industrialization.

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Foundries Process Technologies Roadmaps 

TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

October 26, 2021October 26, 2021 David Schor 5 nm, Extreme Ultraviolet (EUV) Lithography, FinFET, N4, N4P, N5, TSMC

TSMC introduces a new 5-nanometer derivative – an enhanced performance N4P node.

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Packaging Roadmaps 

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor 3D packaging, die stacking, EMIB, Foveros, Intel

Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding

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Foundries Process Technologies Roadmaps 

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor Extreme Ultraviolet (EUV) Lithography, Intel, Intel 20A, Intel 3, Intel 4, Intel 7

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

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Foundries Process Technologies Roadmaps 

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor 20 Å, GAA, Intel, Intel 20A, PowerVia, RibbonFET

Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.

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Circuit Design Foundries ISSCC 2021 Process Technologies Roadmaps Subscriber Only Content VLSI 2021 

Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles

July 8, 2021July 8, 2021 David Schor 3 nm, GAA, Samsung, Samsung Foundry, subscriber only (general)

Samsung tapes out 3nm GAA test vehicle as it inches towards mass production

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Foundries Process Technologies Roadmaps Subscriber Only Content 

TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap

July 6, 2021July 6, 2021 David Schor 5 nm, 7 nm, HPC, N5A, N5HPC, N6RF, N7HPC, subscriber only (general)

A TSMC 2021 foundry update: automotive, networking, and HPC roadmap.

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Foundries Process Technologies Roadmaps Subscriber Only Content 

TSMC 2021 Foundry Update: Foundry Roadmap

July 6, 2021July 6, 2021 David Schor 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, Extreme Ultraviolet (EUV) Lithography, FinFET, N2 2 nm, N3, N4, N5, N6, N7, subscriber only (general), TSMC

TSMC 2021 foundry update

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Foundries IEDM 2020 Process Technologies Roadmaps Subscriber Only Content 

Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

May 21, 2021June 24, 2021 David Schor 3 nm, 4 nm, 4LPE, 4LPP, 5 nm, 5LPE, 5LPP, 7 nm, IEDM 2020, Samsung, Samsung Foundry, subscriber only (general)

Samsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.

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Roadmaps 

Arm Highlights Near-Term Roadmap

April 4, 2021May 23, 2021 David Schor ARM, ARMv9, Makalu, Matterhorn, Neoverse N, Neoverse V

Along with the launch of ARMv9, Arm highlighted its near-term roadmap promising strong generational performance improvements.

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  • ← Previous

Top Six Articles

  • A Look At Intel 4 Process Technology
  • A Look At Samsung’s 4LPE Process
  • TSMC Details 5 nm
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects
  • Samsung 5 nm and 4 nm Update

Recent

  • A Look At Samsung’s 4LPE Process

    A Look At Samsung’s 4LPE Process

    June 26, 2022June 26, 2022 David Schor
  • A Look At Intel 4 Process Technology

    A Look At Intel 4 Process Technology

    June 19, 2022June 20, 2022 David Schor
  • Samsung 17nm follows Intel 16

    Samsung 17nm follows Intel 16

    May 22, 2022May 22, 2022 David Schor
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT

    Reincarnating The 6502 Using Flexible TFT Tech For IoT

    May 8, 2022May 8, 2022 David Schor
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    February 20, 2022February 21, 2022 David Schor
  • Samsung-Esperanto Concept AI-SSD Prototype

    Samsung-Esperanto Concept AI-SSD Prototype

    November 21, 2021November 21, 2021 David Schor

Random Picks

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor
Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges

Japan cancels contract, kicks out 4th fastest supercomputer amid fraud charges

April 20, 2018May 25, 2021 David Schor
A Look at Intel’s 10nm Std Cell as TechInsights Reports on the i3-8121U, finds Ruthenium

A Look at Intel’s 10nm Std Cell as TechInsights Reports on the i3-8121U, finds Ruthenium

June 15, 2018May 25, 2021 David Schor
DARPA ERI: HIVE and Intel PUMA Graph Processor

DARPA ERI: HIVE and Intel PUMA Graph Processor

August 4, 2019May 25, 2021 David Schor
Samsung 5 nm and 4 nm Update

Samsung 5 nm and 4 nm Update

October 19, 2019May 25, 2021 David Schor

Random Tags

2.5D packaging 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 AVX-512 chiplet Coffee Lake Core i5 Core i7 Core i9 edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

December 21, 2017May 25, 2021 David Schor
Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies

Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies

November 7, 2019May 25, 2021 David Schor
AMD Tech Day: the momentum continues with new products, new prices, and 12nm and 7nm announcements

AMD Tech Day: the momentum continues with new products, new prices, and 12nm and 7nm announcements

January 8, 2018May 25, 2021 David Schor
Centaur Unveils Its New Server-Class x86 Core: CNS; Adds AVX-512

Centaur Unveils Its New Server-Class x86 Core: CNS; Adds AVX-512

December 9, 2019May 25, 2021 David Schor
Intel Launches 10th Gen Comet Lake vPro Processors

Intel Launches 10th Gen Comet Lake vPro Processors

May 13, 2020May 23, 2021 David Schor
TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

April 17, 2020May 25, 2021 David Schor
Wave to acquire MIPS

Wave to acquire MIPS

June 13, 2018May 25, 2021 David Schor

ARM WorldView All

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor
A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
IEDM 2020 Interconnects Packaging Subscriber Only Content 

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor
Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700
Architectures Interconnects Network-on-Chip 

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor
Arm Launches The DSU-110 For New Armv9 CPU Clusters
Architectures Interconnects Mobile Processors 

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor

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