Roadmaps

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor 3D packaging, die stacking, EMIB, Foveros, Intel

Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding

Foundries Process Technologies Roadmaps

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor Extreme Ultraviolet (EUV) Lithography, Intel, Intel 20A, Intel 3, Intel 4, Intel 7

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

Foundries Process Technologies Roadmaps

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor 20 Å, GAA, Intel, Intel 20A, PowerVia, RibbonFET

Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.

Circuit Design Foundries ISSCC 2021 Process Technologies Roadmaps Subscriber Only Content VLSI 2021

Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles

July 8, 2021July 8, 2021 David Schor 3 nm, GAA, Samsung, Samsung Foundry, subscriber only (general)

Samsung tapes out 3nm GAA test vehicle as it inches towards mass production

Foundries Process Technologies Roadmaps Subscriber Only Content

TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap

July 6, 2021July 6, 2021 David Schor 5 nm, 7 nm, HPC, N5A, N5HPC, N6RF, N7HPC, subscriber only (general)

A TSMC 2021 foundry update: automotive, networking, and HPC roadmap.

Foundries Process Technologies Roadmaps Subscriber Only Content

TSMC 2021 Foundry Update: Foundry Roadmap

July 6, 2021July 6, 2021 David Schor 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, Extreme Ultraviolet (EUV) Lithography, FinFET, N2 2 nm, N3, N4, N5, N6, N7, subscriber only (general), TSMC

TSMC 2021 foundry update

Foundries IEDM 2020 Process Technologies Roadmaps Subscriber Only Content

Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

May 21, 2021June 24, 2021 David Schor 3 nm, 4 nm, 4LPE, 4LPP, 5 nm, 5LPE, 5LPP, 7 nm, IEDM 2020, Samsung, Samsung Foundry, subscriber only (general)

Samsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.

Roadmaps

Arm Highlights Near-Term Roadmap

April 4, 2021May 23, 2021 David Schor ARM, ARMv9, Makalu, Matterhorn, Neoverse N, Neoverse V

Along with the launch of ARMv9, Arm highlighted its near-term roadmap promising strong generational performance improvements.

Architectures Roadmaps

Arm Launches ARMv9

March 30, 2021May 23, 2021 David Schor ARM, ARMv8, ARMv9, Confidential Compute Architecture (CCA), Scalable Vector Extension (SVE), Scalable Vector Extension 2 (SVE2)

Ten years after launching ARMv8, Arm is launching the ARMv9 architecture for the next decade of compute.

Roadmaps Server Processors

Arm Updates Its Neoverse Roadmap: New BFloat16, SVE Support

September 22, 2020May 23, 2021 David Schor ARM, bfloat16, neoverse, Neoverse N, Neoverse V, Perseus, Poseidon, Scalable Vector Extension (SVE), Zeus

Arm updates its Neoverse roadmap with the Neoverse N2 and V1, introducing SVE support for the first time as well as bfloat16 operations. Like the Cortex-X series, the Neoverse V-series will ease its power and area constraints in favor of higher performance.

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