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Wednesday, July 6, 2022
Latest:
  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
  • Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
  • Arm Unveils Next-Gen Flagship Core: Cortex-X3
  • Arm Introduces The Cortex-A715
  • GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas
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Foundries

Foundries Process Technologies Roadmaps 

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor 2 nm, 3 nm, 3GAAE, 3GAAP, 3GAE, 3GAP, 5LPE, GAAFET, nanosheet, Samsung, Samsung Foundry

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

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Foundries 

GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas

June 27, 2022June 27, 2022 David Schor 300mm, GlobalWafers, silicon wafer

GlobalWafers announces plans for a massive 1.2M WPM factory in Sherman, Texas.

Read more
Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor 4 nm, 4LPE, 4LPP, FinFET, Samsung, Samsung Foundry, subscriber only (general)

A look at Samsung’s last leading-edge FinFET process node, 4nm 4LPE.

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Foundries Process Technologies VLSI 2022 

A Look At Intel 4 Process Technology

June 19, 2022June 20, 2022 David Schor 4 nm, 5 nm, 7 nm, Extreme Ultraviolet (EUV) Lithography, Intel, Intel 3, Intel 4, Intel 7, Intel Foundry Services (IFS), Meteor Lake, VLSI 2022, VLSI Symposium

A look at Intel’s next-generation high-performance process technology, Intel 4.

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Foundries Process Technologies Subscriber Only Content 

Samsung 17nm follows Intel 16

May 22, 2022May 22, 2022 David Schor 14 nm, 14LPP, 17 nm, 17LPV, 28 nm, 28LPP, Intel, Intel Foundry Services (IFS), Samsung, Samsung Foundry, subscriber only (general)

Samsung follows Intel 16 with a low-cost high-performance, 17-nanometer, 17LPV node.

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Foundries Process Technologies Roadmaps Subscriber Only Content 

EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

November 20, 2021November 20, 2021 David Schor ASML, Extreme Ultraviolet (EUV) Lithography, High-NA, subscriber only (general)

A look at the current state of EUV machines, the new NXE:3600D, and EUV pellicle readiness and industrialization.

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Foundries Process Technologies Roadmaps 

TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

October 26, 2021October 26, 2021 David Schor 5 nm, Extreme Ultraviolet (EUV) Lithography, FinFET, N4, N4P, N5, TSMC

TSMC introduces a new 5-nanometer derivative – an enhanced performance N4P node.

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Foundries Process Technologies Roadmaps 

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor Extreme Ultraviolet (EUV) Lithography, Intel, Intel 20A, Intel 3, Intel 4, Intel 7

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

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Foundries Process Technologies Roadmaps 

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor 20 Å, GAA, Intel, Intel 20A, PowerVia, RibbonFET

Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.

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Circuit Design Foundries ISSCC 2021 Process Technologies Roadmaps Subscriber Only Content VLSI 2021 

Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles

July 8, 2021July 8, 2021 David Schor 3 nm, GAA, Samsung, Samsung Foundry, subscriber only (general)

Samsung tapes out 3nm GAA test vehicle as it inches towards mass production

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  • ← Previous

Top Six Articles

  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
  • Arm Introduces The Cortex-A715
  • A Look At Intel 4 Process Technology
  • Arm Unveils Next-Gen Flagship Core: Cortex-X3
  • A Look At Samsung’s 4LPE Process
  • TSMC Details 5 nm

Recent

  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

    Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

    July 5, 2022July 5, 2022 David Schor
  • Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

    Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

    June 28, 2022June 28, 2022 David Schor
  • Arm Unveils Next-Gen Flagship Core: Cortex-X3

    Arm Unveils Next-Gen Flagship Core: Cortex-X3

    June 28, 2022June 28, 2022 David Schor
  • Arm Introduces The Cortex-A715

    Arm Introduces The Cortex-A715

    June 28, 2022June 29, 2022 David Schor
  • GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas

    GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas

    June 27, 2022June 27, 2022 David Schor
  • A Look At Samsung’s 4LPE Process

    A Look At Samsung’s 4LPE Process

    June 26, 2022June 26, 2022 David Schor

Random Picks

Arm Ethos is for Ubiquitous AI At the Edge

Arm Ethos is for Ubiquitous AI At the Edge

February 6, 2020May 25, 2021 David Schor
Intel unleashes 8th Gen Core Coffee Lake lineup

Intel unleashes 8th Gen Core Coffee Lake lineup

April 3, 2018May 25, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019May 25, 2021 David Schor
Intel launches Gemini Lake

Intel launches Gemini Lake

December 11, 2017May 25, 2021 David Schor

Random Tags

2.5D packaging 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen Zen 2

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Arm Launches New Neoverse N2 and V1 Server CPUs: 1.4x-1.5x IPC, SVE, and ARMv9

Arm Launches New Neoverse N2 and V1 Server CPUs: 1.4x-1.5x IPC, SVE, and ARMv9

April 27, 2021May 23, 2021 David Schor
UMC Rolls Out 22-Nanometer

UMC Rolls Out 22-Nanometer

December 13, 2019May 25, 2021 David Schor
Arm Unveils Next-Gen Armv9 Little Core: Cortex-A510

Arm Unveils Next-Gen Armv9 Little Core: Cortex-A510

May 25, 2021May 26, 2021 David Schor
Mythic Rolls Out M1000-Series Analog AI Accelerators; Raises $70M Along The Way

Mythic Rolls Out M1000-Series Analog AI Accelerators; Raises $70M Along The Way

August 22, 2021August 22, 2021 David Schor
AMD launches EPYC Embedded 3000 and Ryzen Embedded V1000 SoCs

AMD launches EPYC Embedded 3000 and Ryzen Embedded V1000 SoCs

February 23, 2018May 25, 2021 David Schor
Arm Updates Its Neoverse Roadmap: New BFloat16, SVE Support

Arm Updates Its Neoverse Roadmap: New BFloat16, SVE Support

September 22, 2020May 23, 2021 David Schor
Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality

Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality

May 17, 2020May 23, 2021 David Schor

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

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