Foundries

Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021

David SchorFoundries, Interconnects, Packaging, Process TechnologiesMay 11, 2019 Tagged 10nm, 3D packaging, 7nm, EMIB, HPC, Lakefield

An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

David SchorFoundries, Process Technologies, Roadmaps, Server ProcessorsDecember 20, 2018 Tagged 7LPP, 7nm, Common Platform Alliance, EUV, IBM, POWER, POWER10, Samsung, Z

IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

David SchorARM TechCon 2018, Foundries, Packaging, Process TechnologiesOctober 28, 2018 Tagged 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

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VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

David SchorFoundries, Process Technologies, VLSI 2018July 22, 2018 Tagged 12LP, 12nm, 14LPP, 14nm, FinFET, GlobalFoundries, process technology

A look at GlobalFoundries 12nm Leading Performance technology, 12LP, an enhanced 14nm process. The process was recently presented at the 2018 Symposia on VLSI Technology and Circuits.

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