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TSMC To Build A 5-Nanometer Fab In Arizona; Invest $12B Over The Next 8 Years

TSMC announces its intention to build and operate an advanced 5-nanometer fab in Arizona.

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TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon.

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TSMC Details 5 nm

TSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.

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ASML Q4: NXE:3400C Machines Ramp; Strong Growth Due to EUV in 2020

ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow.

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TSMC Q4: 7nm Dominates Revenue, Preps 5nm Ramp, 6nm By EOY

7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year.

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UMC Rolls Out 22-Nanometer

UMC says it has started rolling out its 22-nanometer planar process, offering a new lower-power and cost-sensitive migration path from existing 40nm and 28nm nodes.

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TSMC 5-Nanometer Update

An update on TSMC’s upcoming 5-nanometer process technology.

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ASML Starts NXE:3400C Shipment, But Supply Constraints Loom

ASML sees strong demand for EUV systems as it starts shipping the new NXE:3400C systems to leading-edge foundries.

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Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021

An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.

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IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.

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