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  • A Look At AMD’s 3D-Stacked V-Cache
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications
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4LPP

Foundries IEDM 2021 Process Technologies Subscriber Only Content 

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor 4 nm, 4LPE, 4LPP, FinFET, Samsung, Samsung Foundry, subscriber only (general)

A look at Samsung’s last leading-edge FinFET process node, 4nm 4LPE.

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Foundries IEDM 2020 Process Technologies Roadmaps Subscriber Only Content 

Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

May 21, 2021June 24, 2021 David Schor 3 nm, 4 nm, 4LPE, 4LPP, 5 nm, 5LPE, 5LPP, 7 nm, IEDM 2020, Samsung, Samsung Foundry, subscriber only (general)

Samsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.

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ARM TechCon 2018 Foundries Packaging Process Technologies 

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

October 28, 2018May 25, 2021 David Schor 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

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Top Six Articles

  • A Look At Intel 4 Process Technology
  • A Look At AMD’s 3D-Stacked V-Cache
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery

Recent

  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    November 1, 2022November 2, 2022 David Schor
  • Intel, SiFive Demo High-Performance  RISC-V Horse Creek Dev Platform On Intel 4 Process

    Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

    October 7, 2022October 7, 2022 David Schor
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    October 4, 2022October 4, 2022 David Schor
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    October 1, 2022October 3, 2022 David Schor

Random Picks

GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

September 21, 2019June 11, 2021 David Schor
Intel Unveils the Tremont Microarchitecture: Going After ST Performance

Intel Unveils the Tremont Microarchitecture: Going After ST Performance

October 24, 2019May 25, 2021 David Schor
Intel Launches 10th Gen Comet Lake Desktop Processors

Intel Launches 10th Gen Comet Lake Desktop Processors

April 30, 2020May 23, 2021 David Schor
Arm’s New Cortex-M55 Breathes Helium

Arm’s New Cortex-M55 Breathes Helium

June 20, 2020May 23, 2021 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor
TSMC Demos SoIC_H for High-Bandwidth HPC Applications

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor
Q1 2021 Foundry Update: Spending Bonanza

Q1 2021 Foundry Update: Spending Bonanza

May 18, 2021May 23, 2021 David Schor
SiFive Launches 7 Series, Their Highest Performance RISC-V Cores

SiFive Launches 7 Series, Their Highest Performance RISC-V Cores

November 8, 2018May 25, 2021 David Schor
Arm’s New Cortex-M55 Breathes Helium

Arm’s New Cortex-M55 Breathes Helium

June 20, 2020May 23, 2021 David Schor
Fujitsu launches a deep learning accelerator for industrial apps

Fujitsu launches a deep learning accelerator for industrial apps

January 16, 2018May 25, 2021 Matt Larson
Goldmont Plus detailed, large improvements, setting the stage for a 32-core model

Goldmont Plus detailed, large improvements, setting the stage for a 32-core model

December 26, 2017May 25, 2021 David Schor

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

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