Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem David SchorARM TechCon 2018, Foundries, Packaging, Process TechnologiesOctober 28, 2018 Tagged 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows. Pages: 1 2 Read more
