4LPE – WikiChip Fuse

ARM TechCon 2019 Process Technologies Roadmaps

Samsung 5 nm and 4 nm Update

October 19, 2019 David Schor 3 Comments 4LPE, 4nm, 5LPE, 5nm, Samsung

Update and analysis of Samsung’s upcoming 5-nanometer and 4-nanometer process technologies.

ARM TechCon 2018 Foundries Packaging Process Technologies

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

October 28, 2018 David Schor 3 Comments 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.