QUEST, A TCI-Based 3D-Stacked SRAM Neural Processor

Attempting to address the memory bandwidth problem, the QUEST neural processor uses 3D-stacked SRAM dies along with ThruChip Interface wireless communication technology to deliver sufficiently high bandwidth to sustain peak processing performance.

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ISSCC 2018: MIT’s low-power hardware crypto RISC-V IoT processor

In recent years, IoT devices have been plagued with security issues. Memory and energy constraints of those low-power devices mean there is very little headroom for complex security implementations. At ISSCC 2018, a team of MIT researchers has attempted to address this problem with their low-power fully in-hardware crypto engine IoT RISC-V processor.

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IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects

At IEDM 2017 and ISSCC 2018 Intel detailed their upcoming 10nm node, an aggressively scaled 7nm-class process technology that features new scaling accelerators as well as cobalt interconnect for the first time in high-volume manufacturing.

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