40 nm

QUEST, A TCI-Based 3D-Stacked SRAM Neural Processor

David SchorArchitectures, Circuit Design, ISSCC 2018, Neural ProcessorsApril 25, 2018 Tagged 3D packaging, 40 nm, 40LP, AI, die stacking, Hokkaido University, ISSCC, ISSCC 2018, Keio University, process technology, TCI, ThruChip Interface, TSMC, TSV

Attempting to address the memory bandwidth problem, the QUEST neural processor uses 3D-stacked SRAM dies along with ThruChip Interface wireless communication technology to deliver sufficiently high bandwidth to sustain peak processing performance.