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  • A Look At AMD’s 3D-Stacked V-Cache
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications
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Fujitsu

Server Processors 

Arm Makes Headway In HPC, Cloud

November 13, 2019May 25, 2021 David Schor ARM, Azure, Cray, exascale, Fujitsu, Marvell, Scalable Vector Extension (SVE), ThunderX, ThunderX2

Arm makes headway in HPC and cloud with Cray’s new support for the Fujitsu A64FX and Microsoft deployment of Marvell’s ThunderX2 processors.

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Foundries 

Fujitsu Semi Sells 300mm Mie Fabs

June 29, 2018May 25, 2021 David Schor 300mm, 40 nm, Fujitsu, Japan, MIFS

Fujitsu is selling its semiconductor factory in Mie to Taiwanese pure-play United Microelectronics

Read more
Supercomputers 

Fujitsu Completes Post-K ARM CPU Prototype

June 24, 2018May 25, 2021 David Schor ARM, ARMv8, Fujitsu, Scalable Vector Extension (SVE), Supercomputers

Fujitsu has completed their Post-K ARM CPU prototype which will power RIKEN’s next-generation Post-K Computer.

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Neural Processors 

Fujitsu launches a deep learning accelerator for industrial apps

January 16, 2018May 25, 2021 Matt Larson accelerator, AI, Arria, edge computing, FPGA, Fujitsu, industrial, neural processors

Fujitsu launches a new deep learning accelerator PCIe card specifically for accelerating inference for edge computers for industrial equipment.

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Top Six Articles

  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
  • A Look At Intel 4 Process Technology
  • Arm Introduces The Cortex-A715
  • Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

Recent

  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    November 1, 2022November 2, 2022 David Schor
  • Intel, SiFive Demo High-Performance  RISC-V Horse Creek Dev Platform On Intel 4 Process

    Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

    October 7, 2022October 7, 2022 David Schor
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    October 4, 2022October 4, 2022 David Schor
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    October 1, 2022October 3, 2022 David Schor

Random Picks

X-Gene 3 gets a second chance at Ampere with a new 32-core 16nm ARM processor

X-Gene 3 gets a second chance at Ampere with a new 32-core 16nm ARM processor

February 5, 2018May 25, 2021 David Schor
Ice Lake Brings A New CPU, GPU, IPU, and I/Os, To Follow By Tiger Lake Next Year

Ice Lake Brings A New CPU, GPU, IPU, and I/Os, To Follow By Tiger Lake Next Year

May 12, 2019May 25, 2021 David Schor
Arm Unveils Next-Gen Armv9 Little Core: Cortex-A510

Arm Unveils Next-Gen Armv9 Little Core: Cortex-A510

May 25, 2021May 26, 2021 David Schor
YouTube Accelerates Transcoding

YouTube Accelerates Transcoding

August 21, 2021August 21, 2021 David Schor
UMC Rolls Out 22-Nanometer

UMC Rolls Out 22-Nanometer

December 13, 2019May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

OCP Makes a Push for an Open Chiplet Marketplace

OCP Makes a Push for an Open Chiplet Marketplace

January 4, 2020May 25, 2021 David Schor
AMD Discloses Initial Zen 2 Details

AMD Discloses Initial Zen 2 Details

November 18, 2018May 25, 2021 David Schor
WikiChip Fuse Moves to a Decaying Paywall Model

WikiChip Fuse Moves to a Decaying Paywall Model

May 13, 2021May 23, 2021 David Schor
Forschungszentrum Jülich is upgrading its computing power

Forschungszentrum Jülich is upgrading its computing power

January 23, 2018May 25, 2021 Matt Larson
AMD 3D Stacks SRAM Bumplessly

AMD 3D Stacks SRAM Bumplessly

June 7, 2021June 7, 2021 David Schor
CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

March 1, 2020May 25, 2021 David Schor
Intel Launches Mainstream Cascade Lake Xeon W Workstation Processors

Intel Launches Mainstream Cascade Lake Xeon W Workstation Processors

October 7, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

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