IEDM | WikiChip Fuse

TSMC Digs Trenches In Search Of Higher Performance

IEDM 2019 Interconnects Packaging Process Technologies December 14, 2019 0

TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.

IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery

Circuit Design Floorplanning IEDM 2018 Process Technologies January 6, 2019 3

Presented at the 64th IEEE International Electron Devices Meeting (IEDM) in December, here’s a look at Intel’s 10-nanometer standard cell library and power delivery system.

IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects

IEDM 2017 ISSCC 2018 Process Technologies February 17, 2018 3

At IEDM 2017 and ISSCC 2018 Intel detailed their upcoming 10nm node, an aggressively scaled 7nm-class process technology that features new scaling accelerators as well as cobalt interconnect for the first time in high-volume manufacturing.

IEDM 2017: Sony’s 3-layer stacked CMOS image sensor technology

IEDM 2017 February 3, 2018 0

At the 2017 IEDM Sony presented their 3-layer stacked state-of-the-art CMOS image sensor (CIS) technology used to minimize rolling shutter distortions and greatly increase the read speed and thus fps through the use of DRAM for temporarily storing the pixel data.

IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

IEDM 2017 Process Technologies December 21, 2017 3

At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.

IEDM 2017: Intel details 22FFL, a relaxed 14nm process for foundry customers, targets mobile and RF apps

IEDM 2017 Process Technologies December 15, 2017 2

At the 2017 IEDM Intel detailed their 22FFL process, a relaxed 14nm process for Intel’s custom foundry customers. 22FFL was optimized for mobile, IoT, and RF applications offering a cost competitive process with excellent performance and simple design rules.

IEDM 2017: AMD’s grand vision for the future of HPC

IEDM 2017 Processors December 5, 2017 1

Capping off a great year, AMD CEO Lisa Su opening address at IEDM 2017 highlighted key challenges for the future, predicting a paradigm shift in the design of processors and systems that will deliver another decade of performance gains.