A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.

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Japanese AI Startup Preferred Networks Designed A Custom Half-petaFLOPS Training Chip

Japanese AI Startup Preferred Networks has been working on a custom training chip with a peak performance of half-petaFLOPS as well as a supercomputer with a peak performance of 2 exaFLOPS (HP).

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