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  • Samsung 17nm follows Intel 16
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC
  • Samsung-Esperanto Concept AI-SSD Prototype
  • EUV State, NXE:3600D, and Pellicle Readiness and Industrialization
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SDM632

Mobile Processors 

Qualcomm Refreshes Mid-Range Lines with the 632, 439, and 429

June 27, 2018May 25, 2021 David Schor 12 nm, 14 nm, 14LPP, ARM, ARMv8, Qualcomm, SDM429, SDM439, SDM632, Snapdragon, Snapdragon 400, Snapdragon 600

Qualcomm has refreshed their mid-range lines with the new Snapdragons 632, 439, and 429 SoCs.

Read more

Top Six Articles

  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
  • The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids
  • TSMC 2021 Foundry Update: Foundry Roadmap
  • Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp
  • AMD 3D Stacks SRAM Bumplessly

Recent

  • Samsung 17nm follows Intel 16

    Samsung 17nm follows Intel 16

    May 22, 2022May 22, 2022 David Schor
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT

    Reincarnating The 6502 Using Flexible TFT Tech For IoT

    May 8, 2022May 8, 2022 David Schor
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    February 20, 2022February 21, 2022 David Schor
  • Samsung-Esperanto Concept AI-SSD Prototype

    Samsung-Esperanto Concept AI-SSD Prototype

    November 21, 2021November 21, 2021 David Schor
  • EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

    EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

    November 20, 2021November 20, 2021 David Schor
  • Intel Launches 12th Gen Core Desktop Alder Lake Processors

    Intel Launches 12th Gen Core Desktop Alder Lake Processors

    October 27, 2021November 3, 2021 David Schor

Random Picks

AMD Launches Ryzen Pro 4000 Series

AMD Launches Ryzen Pro 4000 Series

May 7, 2020May 23, 2021 David Schor
Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

May 21, 2021June 24, 2021 David Schor
Leaked Intel Server Roadmap Shows Sapphire Rapids With DDR5/PCIe 5.0 For 2021, Granite Rapids For 2022

Leaked Intel Server Roadmap Shows Sapphire Rapids With DDR5/PCIe 5.0 For 2021, Granite Rapids For 2022

May 21, 2019May 25, 2021 David Schor
Intel Announces Keem Bay: 3rd Generation Movidius VPU

Intel Announces Keem Bay: 3rd Generation Movidius VPU

November 12, 2019May 25, 2021 David Schor
VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

June 17, 2018May 25, 2021 David Schor

Random Tags

2.5D packaging 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 12nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 edge computing EMIB EUV FinFET Foveros GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Core i7-8086K Overclockability Silicon Lottery Stats

Core i7-8086K Overclockability Silicon Lottery Stats

June 17, 2018May 25, 2021 David Schor
SEMICON West 2019: ASML EUV Update

SEMICON West 2019: ASML EUV Update

July 21, 2019May 25, 2021 David Schor
AMD introduces Ryzen 2nd Gen up for pre-order

AMD introduces Ryzen 2nd Gen up for pre-order

April 13, 2018May 25, 2021 David Schor
Esperanto exits stealth mode, aims at AI with a 4,096-core 7nm RISC-V monster

Esperanto exits stealth mode, aims at AI with a 4,096-core 7nm RISC-V monster

January 1, 2018May 25, 2021 David Schor
Hot Chips 30: Intel Kaby Lake G

Hot Chips 30: Intel Kaby Lake G

September 9, 2018May 25, 2021 David Schor
IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

December 20, 2018May 25, 2021 David Schor
Ranovus Odin: Co-Packaging Next-Gen DC Switches and Accelerators With Silicon Photonics

Ranovus Odin: Co-Packaging Next-Gen DC Switches and Accelerators With Silicon Photonics

April 11, 2020May 25, 2021 David Schor

ARM WorldView All

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor
A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
IEDM 2020 Interconnects Packaging Subscriber Only Content 

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor
Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700
Architectures Interconnects Network-on-Chip 

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor
Arm Launches The DSU-110 For New Armv9 CPU Clusters
Architectures Interconnects Mobile Processors 

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor

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