x86 – WikiChip Fuse

Intel, AMD Add New Mobile Pro Processors

David SchorMobile ProcessorsApril 16, 2019 Tagged AMD, Intel, x86

This month both Intel and AMD introduced new mobile processors for business with enterprise security features.

Intel Rolls Out Next-Gen Data Center Portfolio; 100 Gigabit Ethernet, Optane DC, Hewitt Lake, and Cascade Lake With Up to 56 Cores

David SchorArchitectures, Embedded Processors, Server ProcessorsApril 2, 2019 Tagged 14nm, 800 Series Ethernet, Cascade Lake, Columbiaville, data center, Hewitt Lake, Optane DC, Skylake-SP, Speed Select Technology, x86, Xeon Bronze, Xeon D, Xeon Gold, Xeon Platinum, Xeon Scalable, Xeon Silver

Intel is launching their next-generation data center infrastructure product portfolio including Cascade Lake with up to 56 cores, new lower-power Hewitt Lake processors, Optane DC SSD and persistent memory DIMMs, as well as 100 Gb Ethernet.

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Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips

David SchorArchitectures, Desktop Processors, Roadmaps, Server ProcessorsDecember 23, 2018 Tagged 10nm, 7nm, AVX-512, Foveros, Golden Cove, Gracemont, Ice Lake, Palm Cove, Sunny Cove, Tremont, Willow Cove, x86

Last week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.

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Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes

David SchorInterconnects, Packaging, Process TechnologiesDecember 22, 2018 Tagged 10nm, 2.5D packaging, 3D packaging, 5nm, 7nm, EMIB, Foveros, heterogeneous integration, interconnects, interposer, Lakefield, multi-chip package, Packaging, x86

At the recent Intel Architecture Day, the company unveiled their latest advanced packaging technology called Foveros, a face-to-face three-dimensional (3D) die stacking packaging technology in an effort to assist with the slowing of Moore’s Law.

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AMD Discloses Initial Zen 2 Details

David SchorArchitectures, Server ProcessorsNovember 18, 2018 Tagged 14nm, 7nm, AMD, Rome, x86, Zen, Zen 2, Zen 4

Following AMD’s recent Zen 2 and Rome disclosure, here’s a look at what has changed and what second-generation EPYC brings to the table.

Intel Cascade Lake Brings Hardware Mitigations, AI Acceleration, SCM Support

David SchorArchitectures, Hot Chips 30, Server ProcessorsNovember 11, 2018 Tagged 14nm, AVX-512, AVX512VNNI, Cascade Lake, Cascade Lake AP, Cascade Lake SP, CSL, CSX, Intel, persistent memory, SCM, Skylake, storage-class memory, x86

A look at Cascade Lake, Intel’s microarchitecture for next-generation Xeon microprocessors featuring process enhancements, persistent memory support, and AI acceleration.

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