Your Chips and Semi News
Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.
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A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.
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First detailed at Hot Chips 31, Intel Spring Hill morphs the Ice Lake SoC into a highly power-efficient data center inference accelerator.
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Intel launches 10th Generation Core based on the Ice Lake microarchitecture with a lineup of 11 new mobile chips with a turbo of up to 4.1 GHz
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Intel disclosed additional details about their upcoming Sunny Cove core, claiming a large improvement in single-thread performance.
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Intel announces 10th Generation Core based on the 10nm Ice Lake Chips which are now shipping to OEMs.
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Last week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.
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