Your Chips and Semi News
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the prior generation.
Read more
Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.
Read more
A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.
Read more
First detailed at Hot Chips 31, Intel Spring Hill morphs the Ice Lake SoC into a highly power-efficient data center inference accelerator.
Read more
Intel launches 10th Generation Core based on the Ice Lake microarchitecture with a lineup of 11 new mobile chips with a turbo of up to 4.1 GHz
Read more
Intel disclosed additional details about their upcoming Sunny Cove core, claiming a large improvement in single-thread performance.
Read more
Intel announces 10th Generation Core based on the 10nm Ice Lake Chips which are now shipping to OEMs.
Read more
Last week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.
Read more