WikiChip Fuse
Intel Launches Lakefield: An Experiment With Multiple New Technologies

Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.

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A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.

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Intel Spring Hill: Morphing Ice Lake SoC Into A Power-Efficient Data Center Inference Accelerator

First detailed at Hot Chips 31, Intel Spring Hill morphs the Ice Lake SoC into a highly power-efficient data center inference accelerator.

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Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips

Intel launches 10th Generation Core based on the Ice Lake microarchitecture with a lineup of 11 new mobile chips with a turbo of up to 4.1 GHz

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Intel Sunny Cove Core To Deliver A Major Improvement In Single-Thread Performance, Bigger Improvements To Follow

Intel disclosed additional details about their upcoming Sunny Cove core, claiming a large improvement in single-thread performance.

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Intel Announces 10th Gen Core Processors Based On 10nm Ice Lake, Now Shipping

Intel announces 10th Generation Core based on the 10nm Ice Lake Chips which are now shipping to OEMs.

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Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips

Last week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.

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