One of the industry's go-to packaging technology for integrating high-bandwidth memory is TSMC's CoWoS technology. It's a mature technology that has been shipping since 2011. Since then the company has been building on this technology with 4 additional generations of improvements including extending it to six HBM stacks and double the reticle size. More recently, TSMC also focused on additional features that improve the power delivery network such as iCaps.
This year, the company is rolling out its 5th generation CoWoS packaging technology, CoWoS-S5, which extends the physical chip to three reticle size Si.