HBM3 – WikiChip Fuse

Packaging Subscriber Only Content

5th Gen CoWoS-S Extends 3 Reticle Size

August 2, 2021August 2, 2021 David Schor 2.5D packaging, CoWoS, HBM2e, HBM3, interposer, subscriber only (general), TSMC

TSMC’s 5th Generation CoWoS-S Extends 3 Reticle Size.