VLSI Symposium

Intel Expands 22FFL With Production-Ready RRAM and MRAM on FinFET

Process Technologies VLSI 2019 October 18, 2019 0

Intel expands its 22FFL process with new production-ready MRAM and RRAM technologies.

TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging

Packaging Process Technologies SEMICON West 2019 VLSI 2019 July 28, 2019 3

An update on TSMC current and forthcoming logic process nodes as well as their next-generation advanced packaging technologies.

TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC

Interconnects Packaging Server Processors VLSI 2019 June 22, 2019 0

A look at a high-performance 7nm Arm-based chiplet architecture which was recently presented by TSMC at the 2019 VLSI Symposium.

TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO

Process Technologies VLSI 2019 June 16, 2019 6

Update and analysis of TSMC 7-nanometer node low-power and high-performance cells, 2nd generation 7nm, and the design technology co-optimization (DTCO) effort that went into the Snapdragon 855 SoC.

VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

Process Technologies VLSI 2018 August 4, 2018 2

A look at Samsung’s 2nd generation 7nm process that was recently disclosed at the 38th Symposium on VLSI Technology.

VLSI 2018: Samsung’s 8nm 8LPP, a 10nm extension

Process Technologies VLSI 2018 July 1, 2018 3

A look at Samsung’s 8nm 8LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

VLSI 2018: Samsung’s 11nm nodelet, 11LPP

Process Technologies VLSI 2018 June 30, 2018 0

A look at Samsung’s 11nm 11LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

VLSI 2018 June 17, 2018 0

A preview of some of the process technology papers from next week’s VLSI Symposium.