7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year.
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TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging
PackagingProcess TechnologiesSEMICON West 2019VLSI 2019 July 28, 2019 3
An update on TSMC current and forthcoming logic process nodes as well as their next-generation advanced packaging technologies.
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SEMICON West 2019: ASML EUV Update
SEMICON West 2019 July 21, 2019 1
An update on the current state of EUV systems which was given by ASML at SEMICON West 2019 earlier this month.
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Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem
ARM TechCon 2018FoundriesPackagingProcess Technologies October 28, 2018 3
Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.
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