ARM – WikiChip Fuse

Architectures Mobile Processors

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor ARM, ARMv9, Cortex, Cortex-A, Cortex-A510

Arm refreshes the Cortex-A510 core, squeezes higher efficiency.

Mobile Processors

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor ARM, Cortex, Cortex-A, Cortex-X, Cortex-X2, Cortex-X3

Arm announces its next-generation flagship core: the Cortex-X3.

Architectures Mobile Processors

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor ARM, ARMv9, Cortex, Cortex-A, Cortex-A710, Cortex-A715, Makalu

Arm introduces next-generation big core: Cortex-A715.

Architectures Server Processors

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor 5 nm, Alibaba, Apsara Conference 2021, ARM, ARMv9, Panjiu, RISC-V, T-Head, TSMC, Xuantie, Yitian 710

Alibaba open-source its high-performance XuanTie RISC-V Cores; introduces a new in-house Armv9 server chip

Data Processing Unit

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor 5 nm, ARM, ARMv9, Data Processing Unit (DPU), Marvell, Neoverse N2, Octeon

Marvell launches the OCTEON 10 DPU series. Fabricated on a 5 nm process, these chips integrate Neoverse N2 cores, AI acceleration, vector packet processing acceleration, a 1 terabit switch, and the latest DDR5 and PCIe 5.0 I/O interfaces

Architectures

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor ARM, ARMv9, ARMv9.2, Confidential Compute Architecture (CCA), confidential computing, Dynamic TrustZone, Realm Management Extension (RME), secure enclave, TrustZone

Arm introduces its Confidential Compute Architecture (CCA) which provides a mechanism for Realms, secure enclaves that may be used by any application in order to protect data in use from everything else on the system.

IEDM 2020 Interconnects Packaging Subscriber Only Content

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor 12 nm, 12LP, 3D packaging, ARM, CMN-600, die stacking, Direct Bond Interconnect (DBI), GlobalFoundries, hybrid bonding, IEDM, IEDM 2020, subscriber only (general), Trishul (Arm test chip)

With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.