WikiChip Fuse
CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

CEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.

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Ayar Labs Realizes Co-Packaged Silicon Photonics

Integrated photonics has long been considered a holy grail for communication. Ayar Labs TeraPHY chiplet represents a major step forward through the co-packaging of the optical interface along with an SoC.

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OCP Bunch of Wires: A New Open Chiplets Interface For Organic Substrates

A look at a Bunch of Wires, a new open standard chiplets interconnect being proposed by the OCP ODSA group intended for standard organic multi-chip packages as a cheaper alternative to silicon interposers and bridges.

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OCP Makes a Push for an Open Chiplet Marketplace

Jumping ahead of emerging semiconductor trends, the OCP new Open Domain-Specific Architecture subgroup makes a push for an open and standardized chiplet interface and marketplace.

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DARPA ERI: How Ayar Labs Collaboration With GF Produces A Photonics Chiplet That Can Supercharge Intel FPGAs

From a DARPA vision and a $15 million seed to a commercialized CMOS silicon photonics product: how Ayar Labs collaboration with GF produces a photonics chiplet that can supercharge Intel FPGAs.

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Nvidia Inference Research Chip Scales to Dozens of Chiplets

Nvidia recently presented a research chip comprising dozens of chiplets that enables them to scale from milliwatts to hundreds of watts in order to cater to different markets such as edge, mobile, automotive, and data center.

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TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC

A look at a high-performance 7nm Arm-based chiplet architecture which was recently presented by TSMC at the 2019 VLSI Symposium.

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