CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor
CEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.
Read moreCEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.
Read moreA look at the 496-core RISC-V manycore array, network-on-chip, and the digital PLL of the Celerity open-source RISC-V tiered accelerator.
Read moreAffirming their commitment to infrastructure, Arm is launching two new server-grade platforms – the Neoverse N1 and E1. The new platforms are designed to offer new Arm-based high-performance compute and high-throughput performance IP options.
Read moreExiting stealth mode, Esperanto, a small start-up lead by Dave Ditzel has unveiled their high-performance RISC-V cores they have been working on. Their first product will be a 4,096-core manycore processor designed for accelerating AI workloads.
Read moreThis morning Intel quietly released three Xeon Phi SKUs up to 72 cores based on Knights Mill, a Deep Learning specific derivative of Knights Landing.
Read morePEZY-SC2 is PEZY’s newest 16nm a many-core processor featuring 2,048 cores that is powering the world’s most power-efficient supercomputer. The chip is the first to use a unique 3D packaging interconnect technology known as TCI in order to achieve a memory bandwidth of over 2 TB/s.
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