Manycore Processors

CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

March 1, 2020 David Schor 0 Comments 28nm, 65 nm, active interposer, CEA-Leti, chiplet, interconnects, interposer, ISSCC, ISSCC 2020, multi-chip package, STMicroelectronics

CEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.

Architectures Circuit Design Manycore Processors Network-on-Chip Neural Processors VLSI 2019

A Look At Celerity’s Second-Gen 496-Core RISC-V Mesh NoC

January 12, 2020 David Schor 0 Comments 16nm, AI, Celerity, DARPA, DARPA CRAFT, inference, Network-on-Chip (NoC), neural processors, PLL, RISC-V, VLSI, VLSI 2019

A look at the 496-core RISC-V manycore array, network-on-chip, and the digital PLL of the Celerity open-source RISC-V tiered accelerator.

Architectures Embedded Processors Manycore Processors Server Processors

Arm Launches New Neoverse N1 and E1 Server Cores

February 20, 2019 David Schor 3 Comments 7nm, AI, Ares, ARM, ARMv8, E1, edge computing, hyperscalers, N1, neoverse, Supercomputers

Affirming their commitment to infrastructure, Arm is launching two new server-grade platforms – the Neoverse N1 and E1. The new platforms are designed to offer new Arm-based high-performance compute and high-throughput performance IP options.

Manycore Processors Neural Processors

Esperanto exits stealth mode, aims at AI with a 4,096-core 7nm RISC-V monster

January 1, 2018 David Schor 2 Comments 7nm, AI, Esperanto, HBM, RISC-V, TSMC

Exiting stealth mode, Esperanto, a small start-up lead by Dave Ditzel has unveiled their high-performance RISC-V cores they have been working on. Their first product will be a 4,096-core manycore processor designed for accelerating AI workloads.

Manycore Processors

Intel silently launches Knights Mill

December 18, 2017 David Schor 0 Comments 14 nm, AI, Deep Learning, Intel, Knights Mill, KNL, x86, Xeon Phi

This morning Intel quietly released three Xeon Phi SKUs up to 72 cores based on Knights Mill, a Deep Learning specific derivative of Knights Landing.

Manycore Processors Processors Supercomputers

The 2,048-core PEZY-SC2 sets a Green500 record

November 1, 2017 David Schor 2 Comments 16FF+, 16nm, 28HPC+, 3D packaging, Green500, liquid immersion, MIPS, MIPS64, PEZY, PEZY-SCx, SMT, Supercomputers, ThruChip Interface, TSMC, Xeon D, ZettaScaler

PEZY-SC2 is PEZY’s newest 16nm a many-core processor featuring 2,048 cores that is powering the world’s most power-efficient supercomputer. The chip is the first to use a unique 3D packaging interconnect technology known as TCI in order to achieve a memory bandwidth of over 2 TB/s.