Processors

Neural Processors Subscriber Only Content

Inside Baidu’s In-House Neural Processor

July 11, 2021July 12, 2021 David Schor 14 nm, 14LPP, 2.5D packaging, Baidu, HBM, Kunlun, neural processors, subscriber only (general)

A peek inside Baidu’s in-house neural processor

Architectures Manycore Processors

A Look At The ET-SoC-1, Esperanto’s Massively Multi-Core RISC-V Approach To AI

July 10, 2021July 12, 2021 David Schor 7 nm, Esperanto, ET-Maxion, ET-Minion, ET-SoC-1, neural processors, RISC-V, TSMC

A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores.

Data Processing Unit

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor 5 nm, ARM, ARMv9, Data Processing Unit (DPU), Marvell, Neoverse N2, Octeon

Marvell launches the OCTEON 10 DPU series. Fabricated on a 5 nm process, these chips integrate Neoverse N2 cores, AI acceleration, vector packet processing acceleration, a 1 terabit switch, and the latest DDR5 and PCIe 5.0 I/O interfaces

Architectures Desktop Processors Interconnects Packaging

AMD 3D Stacks SRAM Bumplessly

June 7, 2021June 7, 2021 David Schor 3D packaging, 3D V-Cache, 7 nm, AMD, Direct Bond Interconnect (DBI), hybrid bonding, Ryzen, SRAM, System on Integrated Chips (SoIC)

AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.