Ryzen

A Look At AMD’s 3D-Stacked V-Cache

December 27, 2022December 27, 2022 David Schor 3D V-Cache, AMD, Direct Bond Interconnect (DBI), hybrid bonding, Ryzen, subscriber only (general), System on Integrated Chips (SoIC)

[Subscription] A technical look at AMD’s 3D-Stacked V-Cache

Architectures Desktop Processors Interconnects Packaging

AMD 3D Stacks SRAM Bumplessly

June 7, 2021June 7, 2021 David Schor 3D packaging, 3D V-Cache, 7 nm, AMD, Direct Bond Interconnect (DBI), hybrid bonding, Ryzen, SRAM, System on Integrated Chips (SoIC)

AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.

Mobile Processors

AMD Launches Ryzen Pro 4000 Series

May 7, 2020May 23, 2021 David Schor 7 nm, AMD, Ryzen, Ryzen Pro, Zen 2

AMD launches its Zen 2-based Ryzen Pro 4000 series for enterprise customers.

Desktop Processors

AMD introduces Ryzen 2nd Gen up for pre-order

April 13, 2018May 25, 2021 David Schor 14 nm, AMD, Ryzen, x86, Zen

Ahead of its April 19th release, AMD is now offering pre-orders for their 2nd Generation, Ryzen 2000 family, desktop processors.

Architectures Circuit Design Floorplanning ISSCC 2018

ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging

March 24, 2018May 25, 2021 David Schor 14 nm, 2D packaging, AMD, AMD's infinity fabric, EPYC, multi-chip package, Ryzen, x86, Zen

A look at AMD’s Zeppelin SoC and the Infinity Fabric, a multi-chip architecture used by AMD to scale their SoC design from the mainstream PC market all the way to the server market.

Embedded Processors Server Processors

AMD launches EPYC Embedded 3000 and Ryzen Embedded V1000 SoCs

February 23, 2018May 25, 2021 David Schor 14 nm, AMD, edge computing, EPYC, Ryzen, Vega, x86, Zen

After covering the server and PC markets, AMD has ventured into the edge-computing and embedded market with their latest Zen microarchitecture with the launch of two low-power embedded microprocessor families.

CES 2018 Processors

AMD Tech Day: the momentum continues with new products, new prices, and 12nm and 7nm announcements

January 8, 2018May 25, 2021 David Schor 12nm, 7nm, AM4, AMD, GlobalFoundries, Navi, Radeon, Radeon Vega, Ryzen, Ryzen Mobile, Ryzen Pro, Vega, x86, Zen, Zen 2, Zen 3

As they continue on building momentum, AMD held an impressive Tech Day at CES 2018 unveiling a series of products and detailing their aggressive roadmap going forward.