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  • A Look At AMD’s 3D-Stacked V-Cache
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications
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Radeon Vega

Circuit Design Hot Chips 30 Packaging 

Hot Chips 30: Intel Kaby Lake G

September 9, 2018May 25, 2021 David Schor 14 nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86

A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.

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Architectures Circuit Design Hot Chips 30 

Hot Chips 30: AMD Raven Ridge

August 26, 2018May 25, 2021 David Schor 14 nm, 14LPP, AMD, AMD's infinity fabric, APU, Hot Chips, Hot Chips 30, Radeon Vega, Raven Ridge, Vega, x86, Zen

Overview of AMD Raven Ridge APUs that were recently detailed at Hot Chips 30.

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CES 2018 Processors 

AMD Tech Day: the momentum continues with new products, new prices, and 12nm and 7nm announcements

January 8, 2018May 25, 2021 David Schor 12nm, 7nm, AM4, AMD, GlobalFoundries, Navi, Radeon, Radeon Vega, Ryzen, Ryzen Mobile, Ryzen Pro, Vega, x86, Zen, Zen 2, Zen 3

As they continue on building momentum, AMD held an impressive Tech Day at CES 2018 unveiling a series of products and detailing their aggressive roadmap going forward.

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Top Six Articles

  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • A Look At Intel 4 Process Technology
  • Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • Intel Silently Launches Cannon Lake

Recent

  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    November 1, 2022November 2, 2022 David Schor
  • Intel, SiFive Demo High-Performance  RISC-V Horse Creek Dev Platform On Intel 4 Process

    Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

    October 7, 2022October 7, 2022 David Schor
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    October 4, 2022October 4, 2022 David Schor
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    October 1, 2022October 3, 2022 David Schor

Random Picks

Arm Highlights Near-Term Roadmap

Arm Highlights Near-Term Roadmap

April 4, 2021May 23, 2021 David Schor
8th Gen Coffee Lake and 9th Gen Lineup

8th Gen Coffee Lake and 9th Gen Lineup

November 24, 2017May 25, 2021 David Schor
Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

October 1, 2022October 3, 2022 David Schor
Samsung Discloses Exynos M4 Changes, Upgrades Support for ARMv8.2, Rearranges The Back-End

Samsung Discloses Exynos M4 Changes, Upgrades Support for ARMv8.2, Rearranges The Back-End

January 14, 2019May 25, 2021 David Schor
Intel Launches Desktop Xeon E, Their Fastest Entry-Level Workstation Processors

Intel Launches Desktop Xeon E, Their Fastest Entry-Level Workstation Processors

July 13, 2018May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel Spring Hill: Morphing Ice Lake SoC Into A Power-Efficient Data Center Inference Accelerator

Intel Spring Hill: Morphing Ice Lake SoC Into A Power-Efficient Data Center Inference Accelerator

October 20, 2019May 25, 2021 David Schor
Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons

Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons

July 15, 2019May 25, 2021 David Schor
Intel Talks 10nm DTCO, EUV Benefits

Intel Talks 10nm DTCO, EUV Benefits

June 22, 2021August 2, 2021 David Schor
Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

May 21, 2021June 24, 2021 David Schor
IEDM 2017: Sony’s 3-layer stacked CMOS image sensor technology

IEDM 2017: Sony’s 3-layer stacked CMOS image sensor technology

February 3, 2018May 25, 2021 David Schor
ASML Starts NXE:3400C Shipment, But Supply Constraints Loom

ASML Starts NXE:3400C Shipment, But Supply Constraints Loom

October 17, 2019May 25, 2021 David Schor
AMD Announces 3rd Gen Ryzen Threadripper

AMD Announces 3rd Gen Ryzen Threadripper

November 8, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

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