Hot Chips 30: Intel Kaby Lake G David SchorCircuit Design, Hot Chips 30, PackagingSeptember 9, 2018 Tagged 14nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86 A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30. Pages: 1 2 Read more
Hot Chips 30: AMD Raven Ridge David SchorArchitectures, Circuit Design, Hot Chips 30August 26, 2018 Tagged 14LPP, 14nm, AMD, AMD's infinity fabric, APU, Hot Chips, Hot Chips 30, Radeon Vega, Raven Ridge, Vega, x86, Zen Overview of AMD Raven Ridge APUs that were recently detailed at Hot Chips 30. Pages: 1 2 3 Read more
AMD Tech Day: the momentum continues with new products, new prices, and 12nm and 7nm announcements David SchorCES 2018, ProcessorsJanuary 8, 2018 Tagged 12nm, 7nm, AM4, AMD, GlobalFoundries, Navi, Radeon, Radeon Vega, Ryzen, Ryzen Mobile, Ryzen Pro, Vega, x86, Zen, Zen 2, Zen 3, Zen+ As they continue on building momentum, AMD held an impressive Tech Day at CES 2018 unveiling a series of products and detailing their aggressive roadmap going forward. Pages: 1 2 3 Read more
