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Sunday, June 26, 2022
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  • A Look At Samsung’s 4LPE Process
  • A Look At Intel 4 Process Technology
  • Samsung 17nm follows Intel 16
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC
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Raven Ridge

Architectures Circuit Design Hot Chips 30 

Hot Chips 30: AMD Raven Ridge

August 26, 2018May 25, 2021 David Schor 14 nm, 14LPP, AMD, AMD's infinity fabric, APU, Hot Chips, Hot Chips 30, Radeon Vega, Raven Ridge, Vega, x86, Zen

Overview of AMD Raven Ridge APUs that were recently detailed at Hot Chips 30.

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Top Six Articles

  • A Look At Intel 4 Process Technology
  • A Look At Samsung’s 4LPE Process
  • TSMC Details 5 nm
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects
  • Zhaoxin launches their highest-performance Chinese x86 chips

Recent

  • A Look At Samsung’s 4LPE Process

    A Look At Samsung’s 4LPE Process

    June 26, 2022June 26, 2022 David Schor
  • A Look At Intel 4 Process Technology

    A Look At Intel 4 Process Technology

    June 19, 2022June 20, 2022 David Schor
  • Samsung 17nm follows Intel 16

    Samsung 17nm follows Intel 16

    May 22, 2022May 22, 2022 David Schor
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT

    Reincarnating The 6502 Using Flexible TFT Tech For IoT

    May 8, 2022May 8, 2022 David Schor
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    February 20, 2022February 21, 2022 David Schor
  • Samsung-Esperanto Concept AI-SSD Prototype

    Samsung-Esperanto Concept AI-SSD Prototype

    November 21, 2021November 21, 2021 David Schor

Random Picks

Leaked Intel Server Roadmap Shows Sapphire Rapids With DDR5/PCIe 5.0 For 2021, Granite Rapids For 2022

Leaked Intel Server Roadmap Shows Sapphire Rapids With DDR5/PCIe 5.0 For 2021, Granite Rapids For 2022

May 21, 2019May 25, 2021 David Schor
7nm Boosted Zen 2 Capabilities but Doubled the Challenges

7nm Boosted Zen 2 Capabilities but Doubled the Challenges

February 21, 2020May 25, 2021 David Schor
Cavium Takes ARM to Petascale with Astra

Cavium Takes ARM to Petascale with Astra

August 25, 2018May 25, 2021 David Schor
AMD 3D Stacks SRAM Bumplessly

AMD 3D Stacks SRAM Bumplessly

June 7, 2021June 7, 2021 David Schor
ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

June 16, 2018May 25, 2021 David Schor

Random Tags

2.5D packaging 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 AVX-512 chiplet Coffee Lake Core i5 Core i7 Core i9 edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Arm Launches ARMv9

Arm Launches ARMv9

March 30, 2021May 23, 2021 David Schor
A Look At The Ice Lake Thunderbolt 3 Integration

A Look At The Ice Lake Thunderbolt 3 Integration

August 11, 2019May 25, 2021 David Schor
Intel launches 8th Gen Core with Radeon RX Vega Graphics

Intel launches 8th Gen Core with Radeon RX Vega Graphics

January 7, 2018May 25, 2021 David Schor
A Look At Celerity’s Second-Gen 496-Core RISC-V Mesh NoC

A Look At Celerity’s Second-Gen 496-Core RISC-V Mesh NoC

January 12, 2020May 25, 2021 David Schor
Photonics Chiplet Inches Towards Production

Photonics Chiplet Inches Towards Production

August 16, 2021August 22, 2021 David Schor
DARPA ERI: HIVE and Intel PUMA Graph Processor

DARPA ERI: HIVE and Intel PUMA Graph Processor

August 4, 2019May 25, 2021 David Schor
Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips

Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips

August 1, 2019May 25, 2021 David Schor

ARM WorldView All

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor
A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
IEDM 2020 Interconnects Packaging Subscriber Only Content 

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor
Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700
Architectures Interconnects Network-on-Chip 

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor
Arm Launches The DSU-110 For New Armv9 CPU Clusters
Architectures Interconnects Mobile Processors 

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor

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