ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging David SchorArchitectures, Circuit Design, Floorplanning, ISSCC 2018March 24, 2018 Tagged 14nm, 2D packaging, AMD, AMD's infinity fabric, EPYC, multi-chip package, Ryzen, x86, Zen A look at AMD’s Zeppelin SoC and the Infinity Fabric, a multi-chip architecture used by AMD to scale their SoC design from the mainstream PC market all the way to the server market. Pages: 1 2 3 4 Read more
