POWER9 Scales Up To 1.2 TB/s of I/O, Targets NVLink 3, OpenCAPI Memory for 2019
ArchitecturesFloorplanningHot Chips 30InterconnectsServer Processors October 7, 2018 0
A look at the IBM POWER9 scale-up design recently disclosed at Hot Chips 30 and their plans for a 3rd POWER9 derivative for 2019.
Read more
Hot Chips 30: AMD Raven Ridge
ArchitecturesCircuit DesignHot Chips 30 August 26, 2018 0
Overview of AMD Raven Ridge APUs that were recently detailed at Hot Chips 30.
Read moreTop 6 Trending
-
IBM Releases Power ISA v3.1; To Present POWER10 At Hot Chips 32
-
Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality
-
TSMC Details 5 nm
-
TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter
-
TSMC To Build A 5-Nanometer Fab In Arizona; Invest $12B Over The Next 8 Years
-
TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging
