POWER9 Scales Up To 1.2 TB/s of I/O, Targets NVLink 3, OpenCAPI Memory for 2019
ArchitecturesFloorplanningHot Chips 30InterconnectsServer Processors October 7, 2018 0
A look at the IBM POWER9 scale-up design recently disclosed at Hot Chips 30 and their plans for a 3rd POWER9 derivative for 2019.
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ISSCC 2018: The IBM z14 Microprocessor And System Control Design
ArchitecturesCircuit DesignFloorplanningISSCC 2018Server Processors May 13, 2018 5
A look at the changes and enhancements that were implemented by IBM in their z14 mainframe microprocessor and system control chips.
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The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids
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TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging
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TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter
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Arm’s New Cortex-M55 Breathes Helium
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VLSI 2018: Samsung’s 8nm 8LPP, a 10nm extension
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VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM
